Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
FBGA529: FBGA529, plastic, fine-pitch ball grid array; 529 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.64 mm body
Buy Options
MCIMX535DVV1C
End of Life
12NC: 935321916557
Details
Order
MCIMX535DVV1CR2
End of Life
12NC: 935321916518
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Core Type | 1 x Arm Cortex-A8 |
Operating Frequency [Max] (MHz) | 1000 |
L2 Cache (Max) (KB) | 256 |
| Parameter | Value |
|---|---|
Serial Communication | 1 x I²C, 3 x SPI, 5 x UART |
Ethernet | 1 x 10/100 BaseT |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MCIMX535DVV1C(935321916557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 2136.1 |
MCIMX535DVV1CR2(935321916518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e2 | REACH SVHC | 2136.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MCIMX535DVV1C (935321916557) | No | 3 | 260 | 40 | |||
MCIMX535DVV1CR2 (935321916518) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | CCATS |
|---|---|---|---|
MCIMX535DVV1C (935321916557) | 854231 | 5A992C | G166378 |
MCIMX535DVV1CR2 (935321916518) | 854231 | 5A992C | G166378 |
Discontinued and Replacement Part Data
| Part/12NC | Discontinuance Notice | Last Time Buy Date | Last Time Delivery Date | Replacement |
|---|---|---|---|---|
MCIMX535DVV1C (935321916557) | NOTICE | 2021-02-15 | 2021-06-15 | MCIMX535DVP1C2 (935420971557) |
MCIMX535DVV1CR2 (935321916518) | NOTICE | 2021-02-15 | 2021-06-15 | MCIMX535DVP1C2R2 (935420971518) |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MCIMX535DVV1C (935321916557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MCIMX535DVV1CR2 (935321916518) | ||||
MCIMX535DVV1C (935321916557) | 2021-02-20 | 2021-02-21 | 202102018DN | Non-Auto i.MX53 PBGA Part Number Migration due to Molding Change from Corner-Gate Mold (CGM) to Pin-Gate Mold (PGM) |
MCIMX535DVV1CR2 (935321916518) | ||||
MCIMX535DVV1C (935321916557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCIMX535DVV1CR2 (935321916518) | ||||
MCIMX535DVV1C (935321916557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
More about i.MX535
The i.MX53 family of processors represents our next generation of advanced multimedia and power-efficient implementation of the Arm® Cortex®-A8 core. With core processing speeds up to 1 GHz, the i.MX535 is optimized for both performance and power to meet the demands of high-end, advanced applications requiring mobility and a long battery life. 1080p HD video decode and 720p video encode, two dedicated graphics cores, multiple display and connectivity options, and high level of integration make the i.MX535 a choice platform for smart mobile devices.
The i.MX535 is supported by a companion power management IC (PMIC), MC34709.