202102018DN : Non-Auto i.MX53 PBGA Part Number Migration due to Molding Change from Corner-Gate Mold (CGM) to Pin-Gate Mold (PGM)

As previously mentioned in Advanced PCN 202010043A NXP is announcing the conversion from Corner-Gate Mold (CGM) process platform to Pin-Gate Mold (PGM) process platform for the devices listed in this notification. The change from Corner-Gate Mold (CGM) process to Pin-Gate Mold (PGM) process is driven by NXP assembly subcontractor Amkor Korea announcing it will phase out CGM (Corner-Gate mold) PBGA assembly platform by late June 2021 and production support will be continued with PGM (Pin-Gate mold) PBGA process thereafter. CGM PBGA process platform capacity has been contracting due to the transition to PGM process platform. To support the transition to Pin-Gate Mold (PGM) process this Discontinuance Notification is being issued with new replacement part numbers and qualification results for Pin-Gate Mold (PGM) process. New replacement part numbers are required as devices will have a new case outline. Note: There are no dimensional changes to the package; new case outline is required due to change of physical appearance and part marking format only. Please refer to details of change and qualification results attached. Note: Package identifier will change in the orderable part number (i.e. "VV" will be replaced by "VP"). Due to the unprecedented supply constraints within the Semiconductor Industry and existing backlog profile new orders must be placed on the new replacement parts. There are cases that existing backlog will need to be migrated to the replacement parts. NXP will work with each customer to manage those transitions. For orders transition timing please contact your local sales or distribution representative. NOTWITHSTANDING ANY STATEMENT TO THE CONTRARY CONTAINED IN THIS DISCONTINUATION NOTICE THERE WILL BE NO OPPORTUNITY TO PLACE A FINAL LIFETIME PURCHASE. Pin-Gate Mold Sample Part Numbers: PCIMX535DVP1C2 PCIMX535DVP2C2 PCIMX537CVP8C2 Note: These parts are marked as Prototype but went through the fully qualified production flow.

Discontinuation Information 

This Discontinuation informs that NXP Semiconductors (NXP) is now discontinuing the manufacture of parts. In accordance with NXP product discontinuation policy and JEDEC EIA/JESD48, we are hereby giving notice of these product changes so that our customers and partners can adjust their product purchasing records, or make any final lifetime purchases of the discontinued products that can still be supplied by NXP. 

Discontinued Product Terminology:  

NXP Part Number which includes part type and packing designator as referenced on the Customer’s order. 

Short description of the withdrawal status. Products listed as “Full Withdrawal“ indicate that all Product Types with similar functionality are being discontinued. Products listed as “Version Withdrawal“ indicates that a specific version or package is being discontinued but at least one other Product Type with similar functionality is still available.  

Some Product Types may not be available and are identified as Non-Manufacturable. NXP can no longer produce these products and no supply or inventory exists for various reasons such as “not acceptable product quality” or “unique manufacturing restrictions”. Non-Manufacturable products cannot have a last time buy for commercially impracticable reasons. 

For Limited Availability Product Types, a unique manufacturing or limited inventory or time condition exists. Where Limited Availability coded products are still manufacturable, a limited quantity of the Product Type has been, or will be, produced within NXP remaining capacity to meet our customers, or our distributors, commercially reasonable last time buy orders. Limited Availability products will be scheduled by NXP on a first-come/first-serve basis until the remaining Product Type manufacturing capacity or inventory is depleted. When the inventory for the Limited Availability Product Type is depleted, no additional last time buy order Product Type quantities can be supplied by NXP. 

Standard End of Life Products Types have no known supply restriction and NXP customers and distributors' last time buy orders can be met according to NXP discontinued product (DOD) policy. 

Sole Source indicates that the Product Type being discontinued is unique to NXP Semiconductors. Multiple Sources indicates that the Product Type being discontinued could be available through other suppliers. 

Date indicates the last date NXP will accept an order on the discontinued product. NXP allows a six (6) month last order period for multiple-source products and a nine (9) month last order period for sole-source discontinued products or customer specific products. Last Time Buying is not possible for "Non-Manufacturable" discontinued products. "Limited availability" discontinued products are subject to the remaining product inventory, or limited manufacturing conditions set forth in the DN notice. Ordering shall be limited on a first-come/first serve condition until the remaining product capacity or inventory has been sold. All Last Time Buy order periods are measured from the Issue Date of the Discontinuation Notice. 

Date indicates the last date NXP will ship a discontinued product. Unless a Non-Manufacturable or Limited Availability condition and shorter time period is indicated in the PTA, NXP allows a twelve (12) month delivery time period for discontinued products measured from the Issue Date of the Discontinuation Notice. (For some products, NXP may extend the Last Time Delivery date beyond the standard horizon.) 

NXP 12nc number represents the NXP master internal manufacturing control identification number for reference to each part type, version of the part type or packaging/conditioning (3 last digits), being discontinued. 

Any known NXP replacement 12nc for the discontinued NXP type number is reference only information. NXP replacement part designation is NOT intended as a statement of warranty, or an indication that the listed replacement product meets the same form, fit, function or performance of the discontinued product until such time as NXP customers or distributors qualify such product to their specifications. 

Reason of Change

Assembly subcontractor Amkor converting from Corner-Gate Mold (CGM) process to Pin-Gate Mold (PGM) process. Pin-Gate Mold (PGM) process to be qualified as assurance of supply.

Affected Parts