MCIMX233DJM4C Product Information|NXP

Features


Huashan TA5 ROM 169BGA - Commercial

Package


LFBGA169: LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.8 mm pitch; 11 mm x 11 mm x 1.02 mm body

Buy Options

MCIMX233DJM4C

Active

12NC: 935317278557

Details

Order

Order from distributors

MCIMX233DJM4CR2

Active

12NC: 935317278518

Details

Order

Order from distributors

Operating Features

ParameterValue
Core Type
1 x Arm9
Operating Frequency [Max] (MHz)
454
Serial Communication
1 x I²C, 1 x SPI, 3 x UART

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MCIMX233DJM4C(935317278557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
280.4
MCIMX233DJM4CR2(935317278518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
280.4

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MCIMX233DJM4C
(935317278557)
No
3
260
40
MCIMX233DJM4CR2
(935317278518)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MCIMX233DJM4C
(935317278557)
854231
5A992C
MCIMX233DJM4CR2
(935317278518)
854231
5A992C

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MCIMX233DJM4C
(935317278557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MCIMX233DJM4CR2
(935317278518)
MCIMX233DJM4C
(935317278557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCIMX233DJM4CR2
(935317278518)
MCIMX233DJM4C
(935317278557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MCIMX233DJM4CR2
(935317278518)

More about i.MX233

The i.MX233 applications processor provides ample headroom for consumer and embedded applications without sacrificing battery life.

  • Allows customers to eliminate external components, reducing overall system bill of materials cost
  • Integrates advanced power management technology to manage the power sequencing required by the processor itself
  • Offers low power consumption that can improve energy efficiency
  • Backed by strong enablement for designing differentiated products in less time