MC68F375BGMZP33 Product Information|NXP

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MC68F375BGMZP33

End of Life

12NC: 935325165557

Details

Order

Order from distributors

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC68F375BGMZP33(935325165557)
No
No
N
e0
REACH SVHC
2168.35

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Soldering
MC68F375BGMZP33
(935325165557)
No
3
220
30

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC68F375BGMZP33
(935325165557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC68F375BGMZP33
(935325165557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC68F375BGMZP33
(935325165557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

More about MC68F375

The MC68F375 is a member of the MC68300/68HC16 family of modular microcontrollers. This family includes a series of modules from which numerous microcontrollers (MCU’s) are derived. These modules are connected on-chip via the intermodule bus (IMB).