Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
LQFP144: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body
Buy Options
MC56F8146VFVE
End of Life
12NC: 935316576557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Flash (kB) | 128 |
RAM (kB) | 8 |
Operating Frequency [Max] (MHz) | 40 |
| Parameter | Value |
|---|---|
SPI | 2 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MC56F8146VFVE(935316576557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 1319.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MC56F8146VFVE (935316576557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
MC56F8146VFVE (935316576557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MC56F8146VFVE (935316576557) | 2025-04-16 | 2025-05-26 | 202504006I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MC56F8146VFVE (935316576557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MC56F8146VFVE (935316576557) | 2019-08-07 | 2019-11-04 | 201907018F01 | Tray Supplier Change for LQFP20x20x1.4 Package from Peak to ITW in ASE-CL |
More about 56F834X-814X
NXP® 56F834X and 56F814X digital signal controllers belong to the 56800E core-based DSC family. They combine digital signal processing and microcontroller functionalities on a single chip, with a flexible set of peripherals.
- On-chip integration and ease of implementation help to speed development, lower component count, and significantly reduce system cost
- Simplifies designs while promoting compliance with safety regulations
- Supported by robust development tools to simplify and accelerate time-to-market