MPXHZ6130AC6U Product Information|NXP

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MPXHZ6130AC6U

End of Life

12NC: 935313747174

Details

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Operating Features

ParameterValue
Accuracy (% Error) (Max) (%)
1.5
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Level of Integration
integrated
Output Type
analog
Porting
axial port
Pressure Measurement Type
absolute
ParameterValue
Pressure Range Min-max (MIN-MAX) (kPa)
15 - 115
Pressure Rating (MAX) (psi)
19
Supply Voltage [min] (V)
4.75
Supply Voltage [max] (V)
5.25
Supply Voltage [typ] (V)
5

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MPXHZ6130AC6U(935313747174)
No
Yes
Certificate Of Analysis (CoA)
Yes
H
e4
REACH SVHC
521.5

Quality

Part/12NCSafe Assure Functional SafetyPeak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead Free SolderingLead SolderingLead Free Soldering
MPXHZ6130AC6U
(935313747174)
No
250
250
30
30

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MPXHZ6130AC6U
(935313747174)
854239
EAR99

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
MPXHZ6130AC6U
(935313747174)
NOTICE
2021-05-15
2021-11-15
MPXHZ6130A6U
(935325344174)

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MPXHZ6130AC6U
(935313747174)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPXHZ6130AC6U
(935313747174)
2020-11-132020-11-14202009013DNDiscontinuation Notice for Legacy Pressure Sensor Parts

More about MPXHZ6130A

The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation for automotive, aviation, and industrial applications.

  • Provides a piezoresistive transducer with state-of-the-art, monolithic, signal-conditioned, silicon pressure sensing
  • Combines advanced micromachining techniques, thin-film metallization, and bipolar semiconductor processing
  • Resists high-humidity conditions as well as common automotive media
  • Delivers high reliability of on-chip integration in a small form factor
  • Presents a logical and economical choice for system designs
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