Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C
Package
BGA357: BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm body
Buy Options
MPC860DTCVR66D4
End of Life
12NC: 935309593557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
External Memory Supported | EPROM, SDRAM, SRAM |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MPC860DTCVR66D4(935309593557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 2096.5 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MPC860DTCVR66D4 (935309593557) | No | 3 | 245 | 30 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
MPC860DTCVR66D4 (935309593557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MPC860DTCVR66D4 (935309593557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MPC860DTCVR66D4 (935309593557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MPC860DTCVR66D4 (935309593557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
More about MPC860
The MPC860 PowerQUICC® offers an integrated processor and peripheral solution that can be used in a variety of communications and networking controller applications.
- Delivers higher performance in all areas of device operation including flexibility, extensions in capability, and integration
- Provides lower power consumption than traditional architectures
- Backed by strong third-party tool support through Our Design Alliance Program