MPC5517GAVMG80 Product Information|NXP

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SPC5517GAVMG80

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12NC: 935322911557

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In Stock:450
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Operating Features

ParameterValue
Flash (kB)
1500
RAM (kB)
80
Core Type
e200
Core: Number of cores (SPEC)
2
Operating Frequency [Max] (MHz)
80
CAN
6
ParameterValue
I2C
1
SPI
4
GPIO
145
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105
Supply Voltage [min] (V)
4.5
Supply Voltage [max] (V)
5.25

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MPC5517GAVMG80(935322912557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
828.9
SPC5517GAVMG80(935322911557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
828.9

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MPC5517GAVMG80
(935322912557)
No
3
260
40
SPC5517GAVMG80
(935322911557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MPC5517GAVMG80
(935322912557)
854231
3A991A2
SPC5517GAVMG80
(935322911557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5517GAVMG80
(935322911557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC5517GAVMG80
(935322912557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC5517GAVMG80
(935322912557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5517GAVMG80
(935322911557)
MPC5517GAVMG80
(935322912557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC5510

Designed for body electronics, the NXP MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.

  • Offers high-performance while continuing to meet low-power requirements
  • Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures
  • Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)
  • Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
  • Backed by a third-party ecosystem of development tools and software
More