Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
NXP 32-bit MCU, Power Arch core, 1MB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 144
Package
LQFP144: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body
Buy Options
SPC5516EAMLQ48
Active
12NC: 935313083557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Security Status | COMPANY PUBLIC |
Description | NXP 32-bit MCU, Power Arch core, 1MB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 144 |
| Parameter | Value |
|---|---|
Number of pins | 144 |
Package Style | LQFP |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
SPC5516EAMLQ48(935313083557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 1319.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
SPC5516EAMLQ48 (935313083557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
SPC5516EAMLQ48 (935313083557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SPC5516EAMLQ48 (935313083557) | 2025-04-16 | 2025-05-26 | 202504009I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
SPC5516EAMLQ48 (935313083557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
More about MPC5510
Designed for body electronics, the NXP MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.
- Offers high-performance while continuing to meet low-power requirements
- Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures
- Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)
- Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
- Backed by a third-party ecosystem of development tools and software