MC56F8027VLH Product Information|NXP

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MC56F8027VLH

Active

12NC: 935314082557

Details

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MC56F8027VLHR

Active

12NC: 935314082528

Details

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Order from distributors

Operating Features

ParameterValue
Flash (kB)
32
RAM (kB)
4
Operating Frequency [Max] (MHz)
32
CAN
1
ParameterValue
I2C
1
SPI
1
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105
Supply Voltage [Min to Max] (V)
3 to 3.6

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC56F8027VLH(935314082557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
346.55
MC56F8027VLHR(935314082528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
346.55

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC56F8027VLH
(935314082557)
No
3
260
40
MC56F8027VLHR
(935314082528)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC56F8027VLH
(935314082557)
854231
3A991A2
MC56F8027VLHR
(935314082528)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC56F8027VLH
(935314082557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC56F8027VLHR
(935314082528)
MC56F8027VLH
(935314082557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC56F8027VLHR
(935314082528)
MC56F8027VLH
(935314082557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about 56F802X

NXP® 56F802X digital signal controllers belong to the 56800E core-based DSC family. It combines digital signal processing and microcontroller functionalities on a single chip, with a flexible set of peripherals.

  • Supports industrial lighting and motor control, home appliances, inverters, smart sensors, fire and security systems, switched-mode power supply, power management and medical monitoring
  • On-chip integration and ease of implementation help to speed development, lower component count, and significantly reduce system cost
  • Supported by robust development tools to simplify and accelerate time-to-market