MC56F8013VFAE Product Information|NXP

Buy Options

MC56F8013VFAE

Active

12NC: 935316569557

Details

Order

Order from distributors

MC56F8013VFAER2

Active

12NC: 935316569528

Details

Order

Order from distributors

Operating Features

ParameterValue
Flash (kB)
16
RAM (kB)
4
Operating Frequency [Max] (MHz)
32
ParameterValue
I2C
1
SPI
1
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC56F8013VFAE(935316569557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
188.6
MC56F8013VFAER2(935316569528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
188.6

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC56F8013VFAE
(935316569557)
No
3
260
40
MC56F8013VFAER2
(935316569528)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC56F8013VFAE
(935316569557)
854231
3A991A2
MC56F8013VFAER2
(935316569528)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC56F8013VFAE
(935316569557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC56F8013VFAER2
(935316569528)
MC56F8013VFAE
(935316569557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC56F8013VFAER2
(935316569528)
MC56F8013VFAE
(935316569557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MC56F8013VFAER2
(935316569528)

More about 56F801X

The NXP® 56F801X DSC family combines the power of digital signal processing and the functionality of a microcontroller on a single chip, with a flexible set of peripherals.

  • Provides high-performance 16-bit solutions for motor control applications that require a greater number of pulse width modulators (PWMs)
  • Delivers more control functionality with a smaller memory footprint than competing architectures
  • Includes flexible power saving modes
  • On-chip integration and ease of implementation help to speed development, lower component count, and significantly reduce system cost
  • Supported by robust development tools to simplify and accelerate time-to-market