PowerQUICC® Processor with CPM (2 SCC, 1 SMC), 10/100 Ethernet

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The MPC853T is an "ethernet-only" member of the MPC866 Family. Like the MPC866, the MPC853T is a 0.18 micron version of the PowerQUICC^® Family and can operate up to a maximum of 100 MHz on the MPC8xx Core with a maximum of 66 MHz external bus. The MPC853T has a 1.8 V core and has a 3.3 V I/O operation with 5 V TTL compatibilty. The MPC853T Integrated Communications Controller is a versatile one-chip integrated microprocessor and peripheral combination that can be used in a variety of controller applications. The MPC853T is ideal for voice-enabled systems (TDM-based) and ethernet to ethernet applications such as line cards.

The MPC853T is a Power Architecture-based derivative of NXP^® Semiconductors's Quad Integrated Communications Controller (PowerQUICC).. The CPU on the MPC853T is the MPC8xx core, a 32-bit microprocessor built on Power Architecture technology, incorporating memory management units (MMUs) and instruction and data caches.

Data Sheet

Reference Manual

Product Details

Block Diagram

MPC853T Block Diagram

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Features

Maximum frequency operation of the external bus is 66 MHz in 1:1 mode
Single-issue, 32-bit core (compatible with Power Architecture technology) with 32, 32-bit general-purpose registers (GPRs)
Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
32 address lines
Memory controller (eight banks)
General-purpose timers
System integration unit (SIU)
Interrupts
Communications processor module (CPM)
Two baud rate generators
Two SCCs (serial communication controllers) (10BaseT Ethernet, HDLC, Transparent)
One SMC (serial management channel)
One SPI (serial peripheral interface)
Fast Ethernet controller (FEC)
Time-slot assigner (TSA)
PCMCIA interface
Debug interface
1.8 V Core and 3.3 V I/O operation with 5-V TTL compatibility
256-pin, 23*23 1.27 ball pitch (BGA) package

Part numbers include: MPC853TVR100A, MPC853TVR66A, MPC853TZT100A.

Comparison Table

MPC866 Family Versions and Masks

	Qual	Process	Mask	IMMR [16:31]
Rev 0.3	MC	HiP6W	3L90H	0x0800
Rev A.0	MC	HiP6W	0L96R	0x0801

Note 1: Where nn = 50, 66, 100, or 133

Buy/Parametrics

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Documentation

Quick reference to our documentation types.

1-5 of 31 documents

^{Data Sheet}
MPC852T Hardware Specifications

PDFRev 4Sep 24, 20071.0 MBMPC852TECEnglish
^{Data Sheet}
MPC853T Hardware Specification

PDFRev 1Dec 6, 20041.2 MBMPC853TECEnglish
^{Data Sheet}
MPC852T PowerQUICC^® Technical Summary

PDFRev 1.3Apr 30, 2003390.6 KBMPC852TTSEnglish
^{Reference Manual}
Errata to the MPC866 PowerQUICC^® User’s Manual, Rev. 2

PDFRev 2.2Jun 3, 2010447.1 KBMPC866UMADEnglish
^{Reference Manual}
MPC866 PowerQUICC^® Family Reference Manual

PDFRev 2Dec 10, 200410.9 MBMPC866UMEnglish
^{Reference Manual}
MPC8xx Digital Signal Processing Addendum

PDFRev 0.1Oct 29, 2003695.1 KBMPC8XXRMADEnglish
^{Application Note}
AN13461: NXP Microcontroller Troubleshooting Checklist - Application Note

PDFRev 0Nov 30, 2021303.0 KBAN13461English, 中文
^{Application Note}
SEC 2/3x Descriptor Programmer’s Guide

PDFRev 3Apr 28, 20171.1 MBAN3645English
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^{Application Note}
Verification of the IEEE 1588 Interface

PDFRev 0Jul 6, 2011743.2 KBAN4326English
^{Application Note}
DDR Interleaving for PowerQUICC and QorIQ Processors

PDFRev 1Jun 30, 2010717.3 KBAN3939English
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^{Application Note}
Understanding Device Tree Files in Multicore Hypervisor/LWE Implementations

PDFRev 1Apr 19, 2010828.9 KBAN3649English
^{Application Note}
AN4064, Utilizing 36-Bit Physical Addressing in U-Boot and Linux - Application Notes

PDFRev 0Mar 28, 2010576.8 KBAN4064English
^{Application Note}
Understanding SYSCLK Jitter

PDFRev 1Feb 18, 2010514.4 KBAN4056English
^{Application Note}
Communicating via HDLC over a TDM Interface with a QUICC Engine™ UCC

PDFRev 0Dec 17, 2009718.0 KBAN4026EnglishAssociated File: AN4026SW
^{Application Note}
PowerQUICC™ HDLC Support and Example Code

PDFRev 0Nov 10, 2009496.6 KBAN3966English
^{Application Note}
The SystemID Format for Power Architecture™ Development Systems

PDFRev 2Oct 26, 2009495.3 KBAN3638English
^{Application Note}
Implementing SGMII Interfaces on the PowerQUICC™ III

PDFRev 0Jun 5, 2009692.4 KBAN3869English
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^{Application Note}
Migrating from the MPC852T to the MPC875

PDFRev 1Jan 4, 2007516.4 KBAN2584English
^{Application Note}
Designing with the MPC852T

PDFRev 1Nov 10, 2006606.2 KBAN2568English
^{Application Note}
Migrating from the MPC862 to the MPC866 PowerQUICC^® Processor

PDFRev 1Nov 9, 2006734.3 KBAN2557English
^{Application Note}
AN2100 MPC860 Board Design Checklist

PDFRev 0Jul 30, 1999480.8 KBAN2100English
^{Application Note Software}
Software to accompany application note AN3966

ZIPRev 0Nov 10, 2009330.9 KBAN3966SWEnglish
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^{Application Note Software}
Challenges in Testing for Power Rail Shorts with New Technologies

PDFRev 0Jun 13, 2007163.7 KBAN3372English
^{Application Note Software}
AN2810 Supporting Files

ZIPRev 2Aug 15, 20065.6 KBAN2810SWEnglish
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^{Application Note Software}
Software to Accompany Application Note AN3066

ZIPRev 1Jan 17, 2006184.0 KBAN3066SWEnglish
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^{Application Note Software}
MPC8xx Performance-Driven Optimization of Caches and MMU Configuration

PDFRev 1Jan 17, 2006213.9 KBAN3066English
^Errata
Device Errata for the MPC866 Family

PDFRev 6Oct 28, 2009600.4 KBMPC866CEEnglish
^{Fact Sheet}
USB-ML-PPCBDM Fact Sheet

PDFRev ANov 27, 2007243.8 KBUSBMLPPCBDMFSEnglish
^{Fact Sheet}
MPC853T PowerQUICC^® Processor Family Fact Sheet

PDFRev 2Jun 15, 2007160.3 KBMPC853TFSEnglish
^{Package Information}
PBGA Packaging Customer Tutorial

PDFRev 3Mar 14, 20082.8 MBPBGAPRESEnglish
^{Package Information}
MPC852T Pb-Free Packaging Information

PDFRev 0Apr 16, 2003974.3 KBMPC852TPKGEnglish

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Design Resources

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Hardware

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Software

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Engineering Services

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1-5 of 6 engineering services

^{Independent Design House (IDH)}
Hardware/Software Engineering Services

By NovTech Inc. GoldHQ: Coconut Creek, United StatesSupporting Regions: APAC, EMEA, Americas
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Signal Integrity analysis

By Sintecs BV GoldHQ: Hengelo, NetherlandsSupporting Regions: EMEA, Americas
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Android and Linux Engineering Support

By Lineo Solutions,Inc. GoldHQ: Nagano, Japan - 日本Supporting Regions: APAC
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By Borea GoldHQ: Begunje, SloveniaSupporting Regions: EMEA
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Embedded systems troubleshooting

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