SPC5602PEF0VLL6 Product Information|NXP

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Operating Features

ParameterValue
Flash (kB)
256
RAM (kB)
20
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
64
CAN
2
ParameterValue
SCI
2
DSPI
3
GPIO
64
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105
Supply Voltage [min] (V)
3.3
Supply Voltage [max] (V)
5

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
SPC5602PEF0VLL6(935314664557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2
SPC5602PEF0VLL6R(935314664528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SPC5602PEF0VLL6
(935314664557)
Quality Managed
3
260
40
SPC5602PEF0VLL6R
(935314664528)
Quality Managed
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
SPC5602PEF0VLL6
(935314664557)
854231
3A991A2
SPC5602PEF0VLL6R
(935314664528)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5602PEF0VLL6
(935314664557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SPC5602PEF0VLL6R
(935314664528)
SPC5602PEF0VLL6
(935314664557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5602PEF0VLL6R
(935314664528)
SPC5602PEF0VLL6
(935314664557)
2020-10-302020-11-30202007015INXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments
SPC5602PEF0VLL6
(935314664557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC560xP

The MPC560xP family of MCUs target sophisticated chassis, automotive and industrial applications. They enable electronic replacement for heavy hydraulic and engine-driven systems.

  • Ensures the latest safety requirements for functional safety applications
  • Reduces system complexity, development time, and bill-of-materials costs
  • Improves fuel efficiency
  • Reduces greenhouse gas emissions