Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
NXP 32-bit MCU, Power Arch, 1.5MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 324
Package
BGA324: BGA324, plastic, ball grid array; 324 balls; 1 mm pitch; 23 mm x 23 mm x 1.95 mm body
Buy Options
SPC5553MZQ112
NRND
12NC: 935314337557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Flash (kB) | 1500 |
RAM (kB) | 64 |
Core Type | e200 |
Core: Number of cores (SPEC) | 1 |
Operating Frequency [Max] (MHz) | 112 |
Bus Frequency (typ) (MHz) | 135 |
| Parameter | Value |
|---|---|
CAN | 2 |
SPI | 3 |
GPIO | 220 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
Supply Voltage [min] (V) | 4.5 |
Supply Voltage [max] (V) | 5.25 |
Environmental
| Part/12NC | PbFree | EU RoHS | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
SPC5553MZQ112(935314337557) | No | No |  | e0 | REACH SVHC | 1747.85 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Soldering | Lead Soldering | Lead Soldering | |||||
SPC5553MZQ112 (935314337557) | No | 3 | 245 | 30 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
SPC5553MZQ112 (935314337557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SPC5553MZQ112 (935314337557) | 2025-04-16 | 2025-05-26 | 202504009I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
SPC5553MZQ112 (935314337557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
More about MPC5553
The NXP MPC5553 embedded controller provides an ideal solution for mid-range engine management applications and industrial uses cases requiring complex, real-time control.
- Includes on-chip fast Ethernet controller (FEC)
- Delivers system performance of up to five times that of its MPC500 predecessors
- Supports multiple protocols and customer requirements through intelligent subsystems
- Integrates more functionality on-chip for greater cost effectiveness
- Offers a migration path from the market-leading MPC500 family MCUs, facilitating reuse of legacy software architectures
- Simplifies and speeds designs through comprehensive development tools