Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
NXP 32-bit MCU, Power Arch core, 2MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416
Package
BGA416: BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body
Buy Options
SC5554MZP112R2
NRND
12NC: 935318943518
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Security Status | COMPANY PUBLIC |
Description | NXP 32-bit MCU, Power Arch core, 2MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416 |
| Parameter | Value |
|---|---|
Number of pins | 416 |
Package Style | BGA |
Environmental
| Part/12NC | PbFree | EU RoHS | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
SC5554MZP112R2(935318943518) | No | No |  | e0 | REACH SVHC | 3202.8 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Soldering | Lead Soldering | Lead Soldering | |||||
SC5554MZP112R2 (935318943518) | No | 3 | 245 | 30 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
SC5554MZP112R2 (935318943518) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SC5554MZP112R2 (935318943518) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SC5554MZP112R2 (935318943518) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
More about MPC5554
The MPC5554 MCU enables complex, real-time control for engine management systems. It offers system performance of up to five times that of its MPC500 predecessors along with the reliability and familiarity of proven Power Architecture® technology.
- Reduces costs by integrating more functionality on-chip
- Development support speeds time-to-market
- Supports multiple protocols and customer requirements through intelligent subsystems
- Offers a migration path from the MPC500 MCUs, facilitating reuse of legacy software architectures