MM912G634DM1AE Product Information|NXP

Features


MagniV S12 Relay Driver, 2x HS/ LS, I-sense, 16-bit MCU, 6KB RAM, 48KB Flash, LIN, QFP-EP 48

Package


HLQFP48: HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body

Buy Options

MM912G634DM1AE

Active

12NC: 935311065557

Details

Order

Order from distributors

MM912G634DM1AER2

Active

12NC: 935311065528

Details

Order

Order from distributors

Operating Features

ParameterValue
Additional Features
A/D Converter and Digital I/O, PWM Capable, Stop Mode, Wake, Watchdog Timer

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MM912G634DM1AE(935311065557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
194.8
MM912G634DM1AER2(935311065528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
194.8

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MM912G634DM1AE
(935311065557)
No
3
260
40
MM912G634DM1AER2
(935311065528)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MM912G634DM1AE
(935311065557)
854239
3A991A2
MM912G634DM1AER2
(935311065528)
854239
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MM912G634DM1AE
(935311065557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MM912G634DM1AER2
(935311065528)
MM912G634DM1AE
(935311065557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MM912G634DM1AER2
(935311065528)
MM912G634DM1AER2
(935311065528)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MM912_634

The MM912G634 (48 kB) and MM912H634 (64 kB) are integrated single package solutions that integrate an HCS12 MCU with a SMARTMOS® analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application-specific functions, including a LIN transceiver.

Your customer benefits include:

  • Integrated MCU and analog features in the same package solution
  • A full LIN solution
  • Easy control of high-current motors using relays and current sense features
  • Reduced space, resulting in enhanced reliability
  • Full protection for output stages
  • Economical multifunction solution with few components
  • Low-power mode flexibility
  • Reverse-battery-protected voltage sense

View internal diagram

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