Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
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Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
MagniV S12 Relay Driver, 2x HS/ LS, I-sense, 16-bit MCU, 6KB RAM, 48KB Flash, LIN, QFP-EP 48
HLQFP48: HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body
12NC: 935311065557
Details
Order
12NC: 935311065528
Details
Order
Parameter | Value |
---|---|
Additional Features | A/D Converter and Digital I/O, PWM Capable, Stop Mode, Wake, Watchdog Timer |
Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
MM912G634DM1AE(935311065557) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 194.8 | |
MM912G634DM1AER2(935311065528) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 194.8 |
Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MM912G634DM1AE (935311065557) | No | 3 | 260 | 40 | |||
MM912G634DM1AER2 (935311065528) | No | 3 | 260 | 40 |
Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
---|---|---|
MM912G634DM1AE (935311065557) | 854239 | 3A991A2 |
MM912G634DM1AER2 (935311065528) | 854239 | 3A991A2 |
Part/12NC | Issue Date | Effective Date | PCN | Title |
---|---|---|---|---|
MM912G634DM1AE (935311065557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MM912G634DM1AER2 (935311065528) | ||||
MM912G634DM1AE (935311065557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MM912G634DM1AER2 (935311065528) | ||||
MM912G634DM1AER2 (935311065528) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
The MM912G634 (48 kB) and MM912H634 (64 kB) are integrated single package solutions that integrate an HCS12 MCU with a SMARTMOS® analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application-specific functions, including a LIN transceiver.
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