MM908E621ACPEK Product Information|NXP

Features


Integrated motor driver; 4x H-B, 3x HSS, VREG, 8-bit MCU, 16KB Flash, LIN, SOIC-EP 54

Package


HSOP54: HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.22 mm body

Buy Options

MM908E621ACPEK

End of Life

12NC: 935315882574

Details

Order

Order from distributors

Operating Features

ParameterValue
Package Style
HSOP
Memory
INTEGRATED FLASH

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MM908E621ACPEK(935315882574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
847.7

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MM908E621ACPEK
(935315882574)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MM908E621ACPEK
(935315882574)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MM908E621ACPEK
(935315882574)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MM908E621ACPEK
(935315882574)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MM908E621

The NXP® MM908E621 is an integrated single package solution that includes a high performance HC08 MCU with a SMARTMOS® analog control IC.

  • The HC08 includes flash memory, a timer, enhanced serial communications interface, a 10 bit analog-to-digital converter, internal serial peripheral interface, and an internal clock generator module
  • The single package solution, together with LIN, provides optimal application performance adjustments and space saving PCB design
  • Well-suited for the control of automotive high end mirrors