MK22DX256VMC5 Product Information|NXP

Features


Kinetis® K22-50 MHz, Cost Effective, Full-Speed USB Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core

Package


LFBGA121: LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.3 mm body

Buy Options

MK22DX256VMC5

Active

12NC: 935324612557

Details

Operating Features

ParameterValue
Core Type
Arm Cortex-M4
Operating Frequency [Max] (MHz)
50
SRAM (kB)
32
Flash (kB)
320
EEPROM (kB)
0.004
UART
4
SPI
2
I2C
2
ParameterValue
USB Controllers
1
GPIO
56
ADC (16 bit)
1
16-bit PWM
12
Security
CRC
Supply Voltage [min] (V)
1.71
Supply Voltage [max] (V)
3.6
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MK22DX256VMC5(935324612557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
196.45

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MK22DX256VMC5
(935324612557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)FootprintCapture Symbol
MK22DX256VMC5
(935324612557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MK22DX256VMC5
(935324612557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MK22DX256VMC5
(935324612557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

More about K22_50

The Kinetis® K22 50 MHz MCU family targets cost-sensitive applications requiring low-power, processing efficiency and mid-range memory density.

  • Includes a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements
  • Provides performance efficiency with low power
  • Delivers significant BOM savings through smart on-chip integration
  • Shares the comprehensive enablement and scalability of the Kinetis portfolio