Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
PLCC52: PLCC52, plastic leaded chip carrier; 52 terminals; 1.27 mm pitch; 19.12 mm x 19.12 mm x 4.57 mm body
Buy Options
MC68HC11E1CFNE3
End of Life
12NC: 935318971574
Details
Order
MC68HC11E1CFNE3R
End of Life
12NC: 935318971518
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Package Style | PLCC |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MC68HC11E1CFNE3(935318971574) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 2962.55 |
MC68HC11E1CFNE3R(935318971518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e3 | REACH SVHC | 2962.55 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MC68HC11E1CFNE3 (935318971574) | No | 3 | 260 | 40 | |||
MC68HC11E1CFNE3R (935318971518) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer |
|---|---|
MC68HC11E1CFNE3 (935318971574) | 854231 |
MC68HC11E1CFNE3R (935318971518) | 854231 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MC68HC11E1CFNE3 (935318971574) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MC68HC11E1CFNE3R (935318971518) | ||||
MC68HC11E1CFNE3 (935318971574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MC68HC11E1CFNE3R (935318971518) |
More about 68HC11E1
The 68HC11E family MCUs all combine the M68HC11 CPU with high-performance, on-chip peripherals. The E series is comprised of many devices with various configurations of RAM, ROM or EPROM, and EEPROM. Several low-voltage devices are also available. With the exception of a few minor differences, the operation of all E-series MCUs is identical. A fully static design and high-density complementary metal-oxide semiconductor (HCMOS) fabrication process allow E-series devices to operate at frequencies from 3 MHz to dc.