Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
S32R27 multicore Power Architecture, 200 MHz, ISO 26262, AEC-Q100 - S32R MCUs for Radar applications
Package
LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body
Buy Options
FS32R274VCK2VMM
Active
12NC: 935350822557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
ADC (bits) | 12 |
ADC (Channels) | 2 |
Timer | 16 x TIM x 16, 5 x TIM x 32 |
Junction Temperature (Min) (℃) | -40 |
Ethernet Type | 10/100 BaseT |
Core: Number of cores (SPEC) | 2, 2 |
Ethernet Type | 10/100 BaseT |
Description | S32R27 multicore Power Architecture, 200 MHz, ISO 26262, AEC-Q100 - S32R MCUs for Radar applications |
Safety Level | up to ASIL D |
Free Programmable CPU | e200z4, e200z7 |
Supply Voltage [Min - Max] | 0.95, 1.5 |
ADC | 2 |
CAN | 3 |
Operating Frequency [Max] (MHz) | 200 |
ADC COUNT CLOUD | 2 |
Frequency (Max) (kHz) | 200000 |
Supply Voltage [max] (V) | 1.5 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Supply Voltage [min] (V) | 0.95 |
External Memory Supported | SRAM |
Peripherals | ADC, CAN, DAC, ETH, FlexRay, I²C, I²S, LINFlexD, PWM, SPI, TIM, TIM, Zipwire |
PWM (bit) | 16 |
Memory Size (B) | 1500000, 2000000 |
PHY | CAN |
Supply Voltage [Min to Max] (V) | 0.95 to 1.5 |
Peripheral Type | ADC, CAN, DAC, ETH, FlexRay, I²C, I²S, LINFlexD, PWM, SPI, TIM, TIM, Zipwire |
ADC (bits) | 12 |
Ethernet w/ 1588 | 1 |
AEC-Q100 Temperature Range | grade 1 |
Serial Communication | 1 x FlexRay, 1 x LINFlexD, 1 x Zipwire, 2 x I²C, 2 x SPI |
ADC [Number, bits] | 2 x 12 |
CAN Channels | 3 |
Core Type | 2 x e200z4, 2 x e200z7 |
DAC (bits) | 12 |
Number of pins | 257 |
Package Style | LFBGA |
Peripheral Type | ADC, CAN, DAC, ETH, FlexRay, I²C, I²S, LINFlexD, PWM, SPI, TIM, TIM, Zipwire |
SRAM (Bytes) | 1500000 |
DAC Resolution | 12 |
eTSEC | 52 |
TDM | 52 |
External Memory Interface | 1500000 x SRAM |
I2C | 2 |
J1850 | 52 |
| Parameter | Value |
|---|---|
I2S | 2 |
SLIC | 52 |
Tvj [max] (℃) | 130 |
DAC [Number, bits] | 1 x 12 |
Security Status | COMPANY PUBLIC |
SPI | 2 |
DAC (12-bit) | 1 |
Timers [Number, bits] | 16 x 16, 5 x 32 |
PWM [Number, bits] | 12 x 16 |
Flexray | 1 |
Operating Voltage [Min to Max] (V) | 0.95 to 1.5 |
Memory | SRAM |
Core Type | Power Architecture has child e200, e200z2, e200z4, e200z7 |
ADC Resolution | 12 |
Internal Memory Supported | FLASH, SRAM |
PWM | 12 |
Timer (bits) | 16, 32 |
Timers | 21 |
16-bit PWM | 12 |
16-bit Timer | 16 |
IBIZ LOADER | e200z4, e200z7 |
CLOUD_PROD3_NXP_CLOCK_SPEED_MAX | 200 |
32-bit Timer | 5 |
Flash (kB) | 2000 |
Pad supply (V) | 0.95 to 1.5 |
Junction Temperature (Max) (℃) | 130 |
Junction Temperature (Min to Max) (℃) | -40 to 130 |
CLOUD_PROD2_NXP_CLOCK_SPEED_MAX | 200 |
MCU Internal User Flash (SPEC) (kByte) | 2000 |
FlexCan | 3 |
ASIL Certification | up to ASIL D |
Communication protocol | ADC, CAN, DAC, ETH, FlexRay, I²C, I²S, LINFlexD, PWM, SPI, TIM, Zipwire |
CLOUD PROD - Operating Frequency [Max] (MHz) | 200 |
SRAM (kB) | 1500 |
Core Type | e200z4, e200z7 |
Operating Temperature (Min-Max) (℃) | -40 to 105 |
Arm Core | e200z4, e200z7 |
Ethernet | 1 |
Independent ADC Modules | 2 |
Ethernet | 1 x 10/100 BaseT |
Master Interface | ADC, CAN, DAC, ETH, FlexRay, I²C, I²S, LINFlexD, PWM, SPI, TIM, Zipwire |
Controller Interface | ADC, CAN, DAC, ETH, FlexRay, I²C, I²S, LINFlexD, PWM, SPI, TIM, TIM, Zipwire |
Operating Frequency [Max] (MHz) | 200 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
FS32R274VCK2VMM(935350822557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 407.2 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
FS32R274VCK2VMM (935350822557) | ISO 26262 | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | CCATS |
|---|---|---|---|
FS32R274VCK2VMM (935350822557) | 854231 | 5A992C | G163492 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
FS32R274VCK2VMM (935350822557) | 2025-04-16 | 2025-05-26 | 202504006I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
FS32R274VCK2VMM (935350822557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
FS32R274VCK2VMM (935350822557) | 2017-09-16 | 2017-09-17 | 201707028I | S32R274 Datasheet and Reference Manual Update |
More about S32R2X
The S32R264 and S32R274 are an AEC-Q100 Grade 1 qualified 32-bit Power Architecture®-based microcontrollers for automotive and industrial high-performance radar applications.
Both S32R264 and S32R274 MCUs address advanced radar signal processing capabilities and merge it with microcontroller capabilities for generic software tasks and car bus interfacing. It meets the high-performance computation demands required by modern beam-forming fast chirp modulation radar systems by offering signal processing acceleration together with powerful multi-core architecture.
The S32R264 and S32R274 MCUs offer a >4x leap in performance per power vs. the previous MPC577X products, increasing the level of integration available to designers of next-generation automotive radar modules