MMRF5018HS|RF Power GaN Transistor | NXP Semiconductors

125 W CW over 1-2700 MHz, 50 V Airfast® RF Power GaN Transistor

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Features

  • Advanced GaN on SiC, offering high power density
  • Decade bandwidth performance
  • Enhanced thermal resistance packaging
  • Input matched for extended wideband performance
  • High ruggedness: > 20:1 VSWR
  • RoHS compliant

RF Performance Tables

Typical 450–2700 MHz Performance

VDD = 50 Vdc, TA = 25°C, IDQ = 200 mA

Load Mismatch/Ruggedness

1. Measured in 450–2700 MHz reference circuit.
2. Measured in 2500 MHz production test fixture.

Buy/Parametrics










































































































N true 0 PSPMMRF5018HSen 3 Application Note Application Note t789 1 Data Sheet Data Sheet t520 1 Technical Notes Technical Notes t521 1 en_US en_US en Data Sheet Data Sheet 1 1 0 English MMRF5018HS Airfast<sup>&reg;</sup> RF power GaN transistor is optimized for wideband operation up to 2700 MHz and includes input matching for extended bandwidth performance. 1657751021915751619919 PSP 201.9 KB None None documents None 1657751021915751619919 /docs/en/data-sheet/MMRF5018HS.pdf 201923 /docs/en/data-sheet/MMRF5018HS.pdf MMRF5018HS documents N N 2022-07-13 MMRF5018HS 125 W CW over 1-2700 MHz, 50 V Data Sheet /docs/en/data-sheet/MMRF5018HS.pdf /docs/en/data-sheet/MMRF5018HS.pdf Data Sheet N 980000996212993340 2024-03-13 pdf N en Jul 8, 2022 980000996212993340 Data Sheet Y N MMRF5018HS 125 W CW over 1-2700 MHz, 50 V Data Sheet Application Note Application Note 1 2 1 English The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). S989356392744 PSP 664.6 KB None None documents None S989356392744 /docs/en/application-note/AN1908.pdf 664592 /docs/en/application-note/AN1908.pdf AN1908 documents N N 2016-10-31 AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf /docs/en/application-note/AN1908.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Feb 24, 2011 645036621402383989 Application Note Y N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages Technical Notes Technical Notes 1 3 0 English This document explains the format used by NXP<sup>&#174;</sup> for presenting LDMOS impedance information for both single-ended and push-pull devices on RF Power datasheets. 1074535848819727693421 PSP 171.0 KB None None documents None 1074535848819727693421 /docs/en/engineering-bulletin/EB212.pdf 170979 /docs/en/engineering-bulletin/EB212.pdf EB212 documents N N 2016-11-09 Using Data Sheet Impedances for RF LDMOS Devices /docs/en/engineering-bulletin/EB212.pdf /docs/en/engineering-bulletin/EB212.pdf Technical Notes N 389245547230346745 2024-09-13 pdf N en Jan 19, 2004 389245547230346745 Technical Notes Y N Using Data Sheet Impedances for RF LDMOS Devices false 0 MMRF5018HS downloads en true 1 Y PSP Application Note 1 /docs/en/application-note/AN1908.pdf 2016-10-31 S989356392744 PSP 2 Feb 24, 2011 Application Note The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). None /docs/en/application-note/AN1908.pdf English documents 664592 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN1908.pdf AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages 664.6 KB AN1908 N S989356392744 Data Sheet 1 /docs/en/data-sheet/MMRF5018HS.pdf 2022-07-13 1657751021915751619919 PSP 1 Jul 8, 2022 Data Sheet MMRF5018HS Airfast<sup>&reg;</sup> RF power GaN transistor is optimized for wideband operation up to 2700 MHz and includes input matching for extended bandwidth performance. None /docs/en/data-sheet/MMRF5018HS.pdf English documents 201923 None 980000996212993340 2024-03-13 N /docs/en/data-sheet/MMRF5018HS.pdf MMRF5018HS 125 W CW over 1-2700 MHz, 50 V Data Sheet /docs/en/data-sheet/MMRF5018HS.pdf documents 980000996212993340 Data Sheet N en None Y pdf 0 N N MMRF5018HS 125 W CW over 1-2700 MHz, 50 V Data Sheet 201.9 KB MMRF5018HS N 1657751021915751619919 Technical Notes 1 /docs/en/engineering-bulletin/EB212.pdf 2016-11-09 1074535848819727693421 PSP 3 Jan 19, 2004 Technical Notes This document explains the format used by NXP<sup>&#174;</sup> for presenting LDMOS impedance information for both single-ended and push-pull devices on RF Power datasheets. None /docs/en/engineering-bulletin/EB212.pdf English documents 170979 None 389245547230346745 2024-09-13 N /docs/en/engineering-bulletin/EB212.pdf Using Data Sheet Impedances for RF LDMOS Devices /docs/en/engineering-bulletin/EB212.pdf documents 389245547230346745 Technical Notes N en None Y pdf 0 N N Using Data Sheet Impedances for RF LDMOS Devices 171.0 KB EB212 N 1074535848819727693421 true Y Products

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