i.MX 8ULP Applications Processor Family

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Block Diagram

i.MX 8ULP Applications Processors

i.MX8ULP Applications Processors Block Diagram

Features

CPU

  • Up to two Arm® Cortex®-A35 @ 800 MHz
  • Arm Cortex-M33 @ 216 MHz
  • Cadence® Tensillica® Hi-Fi 4 DSP @475 MHz for advanced audio, voice and ML processing and Fusion DSP @200 MHz for low-power voice and sensor hub processing
  • EdgeLock™ secure enclave
  • RISC-V powered Power Management Subsystem (µpower)

Memory

  • 896 KB Total On Chip SRAM

External Memory

  • LPDDR3/LPDDR4/LPDDR4X
  • SPI-NOR
  • SPI-NAND

Graphics

  • 3D GPU includes: Open GL® ES 3.1, OpenCL™ , Vulkan® and Open VG1.1
  • 2D GPU
  • MIPI DSI (4-lane) with PHY
    • Up-to 24-bit RGB (DBI/DPI)
  • Color EPD Display

Connectivity

  • 10/100 Ethernet
  • FlexCAN

Display/Camera

  • MIPI CSI (2-lane) with PHY
  • (ISI) module interfaces: 1 pixel link source to obtain the image data for processing in its pipeline channels

Packaging

  • FCCSP 9.4 X 9.4 mm²
  • MAPBGA 15 x 15 mm²

Temperature Range

  • Industrial (-40 °C to 105 °C)
  • Commercial (0 °C to 95 °C)

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Documentation

Quick reference to our documentation types.

1-5 of 28 documents

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Design Files

Hardware

Quick reference to our board types.

4 hardware offerings

Software

Quick reference to our software types.

5 software files

Note: For better experience, software downloads are recommended on desktop.

Engineering Services

1-5 of 41 engineering services

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To find additional partner offerings that support this product, visit our Partner Marketplace.

Training

3 trainings