Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
VFxxx R 32-bit MPU, ARM Cortex-A5 core, ARM Cortex-M4 core, QFP 176
Package
HLQFP176: HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.50 mm pitch; 24 mm x 24 mm x 1.6 mm body
Buy Options
SVF322R3K1CKU2
Active
12NC: 935324701557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Core Type | Arm Cortex-M4 |
Core: Number of cores (SPEC) | 2 |
RAM (kB) | 1500 |
UART | 4 |
| Parameter | Value |
|---|---|
CAN | 2 |
DSPI | 3 |
I2C | 4 |
ESAI | 1 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
SVF322R3K1CKU2(935324701557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 1866.7 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
SVF322R3K1CKU2 (935324701557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | CCATS |
|---|---|---|---|
SVF322R3K1CKU2 (935324701557) | 854231 | 5A992C | G173573 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SVF322R3K1CKU2 (935324701557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SVF322R3K1CKU2 (935324701557) | 2018-02-15 | 2018-02-16 | 201712016I | VFxxx Controller (Vybrid) Datasheet Revision Update |
More about VF3xxR
The VFxxx automotive VF3xxR is purpose- built and cost-optimized for instrument cluster applications. A dual-core (Arm® Cortex®-A5 + Cortex-M4) architecture handles both MCU and MPU tasks on a single chip. Generous 1.5 MB on-chip SRAM and multiple package options provide scalability from low-cost basic connected radios without external DRAM up to entry-level infotainment systems with dual displays and GPU-accelerated rich, compelling user interfaces.