MVF30NN151CKU26 Product Information|NXP

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MVF30NN151CKU26

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12NC: 935311461557

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Operating Features

ParameterValue
Core Type
Arm Cortex-A5
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
260
RAM (kB)
1500
ParameterValue
UART
4
CAN
2
I2C
2

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MVF30NN151CKU26(935311461557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
1866.7

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MVF30NN151CKU26
(935311461557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MVF30NN151CKU26
(935311461557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MVF30NN151CKU26
(935311461557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MVF30NN151CKU26
(935311461557)
2018-02-152018-02-16201712016IVFxxx Controller (Vybrid) Datasheet Revision Update
MVF30NN151CKU26
(935311461557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about VF3xx

The VFxxx VF3xx family is a single-core (Arm® Cortex®-A5) solution with 1.5 MB on-chip SRAM, dual XiP quad SPI memory interfaces, LCD controller, high-speed USB with PHY, dual Ethernet with an L2 switch, and a digital video camera interface. They are a good fit for solutions that can leverage the large 1.5 MB on-chip SRAM to eliminate costly external DDR memory.

VFxxx devices are ideal for applications including simple HMI in appliances and industrial machines, secure control of infrastructure and manufacturing equipment, energy conversion applications such as motor drives and power inverters, ruggedized wired and wireless connectivity, and control of mobile battery-operated systems such as robots and industrial vehicles. VFxxx devices also provide a powerful combination of on-chip encryption, secure boot, anti-tamper and anti-clone capabilities to secure sensitive or critical infrastructure applications such as smart grid or industrial control.

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