MPC566AZP56 Product Information|NXP

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Operating Features

ParameterValue
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 1MB Flash, 56MHz, -55/+125degC, Automotive Grade, PBGA 388
ParameterValue
Number of pins
388
Package Style
BGA

Environmental

Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MPC566AZP56(935325252557)
No
No
N
e0
REACH SVHC
2450.85

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Soldering
MPC566AZP56
(935325252557)
No
3
240
30

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MPC566AZP56
(935325252557)
854231
3A001A2C

Discontinued and Replacement Part Data

Part/12NCDiscontinuance Notice
MPC566AZP56
(935325252557)
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MPC566AZP56
(935325252557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC566AZP56
(935325252557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC566AZP56
(935325252557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC566

The MPC566 integrates a Power Architecture® core with a dual precision floating point unit and BCC, 36 KB of RAM and 1 MB of flash memory.

The MPC566, an upgraded version of the MPC565, offers code compression to enable more efficient use of internal or external flash memory. Code compression is optimized for automotive (non-cached) applications and the new scheme increases performance by 40 to 50 percent.