MMG3006N Product Information|NXP

Features


InGaP HBT GPA, 400-2400 MHz, 17.5 dB, 33 dBm

Package


HVQFN16: HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.65 mm pitch; 4 mm x 4 mm x 0.9 mm body

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MMG3006NT1(935325421118)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
41.1

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MMG3006NT1
(935325421118)
No
1
260
40

Shipping

Part/12NCHarmonized Tariff (US)Disclaimer
MMG3006NT1
(935325421118)
854233

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MMG3006NT1
(935325421118)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products

More about MMG3006NT1

The MMG3006NT1 is a general purpose amplifier that is internally input prematched and designed for a broad range of Class A, small-signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 400 to 2400 MHz such as Cellular, PCS, WLL, PHS, VHF, UHF, UMTS and general small-signal RF.