MKL26Z128VFM4 Product Information|NXP

Features


Kinetis KL26: 48MHz Cortex-M0+ Ultra-Low Power MCU, 128KB Flash, 16KB SRAM, Full-Speed USB, 32-QFN

Package


HVQFN32: HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.9 mm body

Buy Options

MKL26Z128VFM4

Active

12NC: 935314924557

Details

Quantity

Unit Pricing

1 - 25$3.11
26 - 99$2.87
100+$2.63

Order

$3.11 USD
In Stock:4,890
Order from distributors

Operating Features

ParameterValue
Core Type
Arm Cortex-M0+
Operating Frequency [Max] (MHz)
48
Flash (kB)
128
SRAM (kB)
16
Serial Communication
2 x I²C, 2 x SPI, 3 x UART
I2S
1
USB Controllers
1
ParameterValue
PWM [Number, bits]
10 x 16
ADC [Number, bits]
1 x 16
DAC [Number, bits]
1 x 6
GPIO
23
Supply Voltage [Min to Max] (V)
1.71 to 3.6
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MKL26Z128VFM4(935314924557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e4
REACH SVHC
64.5

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MKL26Z128VFM4
(935314924557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MKL26Z128VFM4
(935314924557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MKL26Z128VFM4
(935314924557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about KL2x

The Kinetis® KL2x is an ultra-low-power MCU family that adds a full-speed USB 2.0 On-the-Go (OTG) controller or a full-speed crystal-less USB 2.0 device controller in addition to the Kinetis KL1x series.

The Kinetis KL2x MCU family is compatible with Kinetis K20 MCUs (based on Arm® Cortex®-M4), and with all other Kinetis KL1x, KL2x, KL3x, and KL4x series MCUs, providing a migration path to lower and higher performance and feature integration.