MK20DX256VLH7 Product Information|NXP

Features


Kinetis® K20-72 MHz, Full-Speed USB, Mixed-Signal Integration Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core

Package


LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body

Buy Options

MK20DX256VLH7

Active

12NC: 935321664557

Details

Order

Order from distributors

Operating Features

ParameterValue
Core Type
Arm Cortex-M4
Operating Frequency [Max] (MHz)
72
SRAM (kB)
64
Flash (kB)
288
EEPROM (kB)
0.002
UART
3
SPI
1
I2C
2
USB Controllers
1
ParameterValue
CAN
1
GPIO
40
ADC (16 bit)
2
16-bit PWM
12
Security
CRC
Supply Voltage [min] (V)
1.71
Supply Voltage [max] (V)
3.6
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MK20DX256VLH7(935321664557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
346.55

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MK20DX256VLH7
(935321664557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)FootprintCapture Symbol
MK20DX256VLH7
(935321664557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MK20DX256VLH7
(935321664557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MK20DX256VLH7
(935321664557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about K20_72

The Kinetis® K20 72 MHz MCU family offers a scalable entry point into the mid-performance Kinetis portfolio with various levels of integration, featuring high-precision analog integration and flexible low-power.

  • Includes a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements
  • Maximizes board space and enhances performance with minimum-length interconnections
  • Enables miniaturization of existing applications
  • Delivers significant BOM savings through smart on-chip integration
  • Shares the comprehensive enablement and scalability of the Kinetis portfolio
More