MC15XS3400CHFK Product Information|NXP

Buy Options

MC15XS3400CHFK

End of Life

12NC: 934070665557

Details

Order

Order from distributors

MC15XS3400CHFKR2

End of Life

12NC: 934070665528

Details

Order

Order from distributors

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC15XS3400CHFK(934070665557)
No
Yes
Certificate Of Analysis (CoA)
Yes
H
e4
REACH SVHC
916.6
MC15XS3400CHFKR2(934070665528)
No
Yes
Certificate Of Analysis (CoA)
Yes
H
e4
REACH SVHC
916.6

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Free SolderingLead SolderingLead Free Soldering
MC15XS3400CHFK
(934070665557)
No
3
260
260
40
40
MC15XS3400CHFKR2
(934070665528)
No
3
260
260
40
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC15XS3400CHFK
(934070665557)
854239
EAR99
MC15XS3400CHFKR2
(934070665528)
854239
EAR99

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC15XS3400CHFK
(934070665557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC15XS3400CHFKR2
(934070665528)
MC15XS3400CHFK
(934070665557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC15XS3400CHFKR2
(934070665528)
MC15XS3400CHFK
(934070665557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MC15XS3400CHFKR2
(934070665528)

More about MC12XS3

The NXP 12XS3 eXtreme Switch Generation 3 12 V devices are SPI-controlled smart high side switches providing diagnostics for the switch, light source and wiring harness, as well as comprehensive fault management and control of the loads without complex software.

  • Programmable multi-step latched overcurrent shutdown protection
  • Minimizes the thermal stress within the device during an overload condition, reducing the junction temperature rise and improving reliability
  • Packaged in a PQFN package and a SOICW-EP package
  • Low RDS(ON) and large integration enable savings in module size, power dissipation and total system cost