MC07XS3200EK Product Information|NXP

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MC07XS3200EKR2

End of Life

12NC: 934070536518

Details

Order

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC07XS3200EK(934070536574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
482.8
MC07XS3200EKR2(934070536518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
482.8

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC07XS3200EK
(934070536574)
No
3
260
40
MC07XS3200EKR2
(934070536518)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC07XS3200EK
(934070536574)
854239
EAR99
MC07XS3200EKR2
(934070536518)
854239
EAR99

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC07XS3200EK
(934070536574)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC07XS3200EKR2
(934070536518)
MC07XS3200EK
(934070536574)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC07XS3200EKR2
(934070536518)
MC07XS3200EK
(934070536574)
2020-01-112020-01-12202001005IMC07XS3200 Data Sheet Update Rev 6.0 for Pin 33 / Exposed Pad Clarification
MC07XS3200EKR2
(934070536518)

More about MC12XS3

The NXP 12XS3 eXtreme Switch Generation 3 12 V devices are SPI-controlled smart high side switches providing diagnostics for the switch, light source and wiring harness, as well as comprehensive fault management and control of the loads without complex software.

  • Programmable multi-step latched overcurrent shutdown protection
  • Minimizes the thermal stress within the device during an overload condition, reducing the junction temperature rise and improving reliability
  • Packaged in a PQFN package and a SOICW-EP package
  • Low RDS(ON) and large integration enable savings in module size, power dissipation and total system cost