MC10XS3412CHFK Product Information|NXP

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MC10XS3412CHFK

End of Life

12NC: 934070637557

Details

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Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC10XS3412CHFK(934070637557)
No
Yes
Certificate Of Analysis (CoA)
Yes
H
e4
REACH SVHC
916.6
MC10XS3412CHFKR2(934070637528)
No
Yes
Certificate Of Analysis (CoA)
Yes
H
e4
REACH SVHC
916.6

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Free SolderingLead SolderingLead Free Soldering
MC10XS3412CHFK
(934070637557)
No
3
260
260
40
40
MC10XS3412CHFKR2
(934070637528)
No
3
260
260
40
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC10XS3412CHFK
(934070637557)
854239
EAR99
MC10XS3412CHFKR2
(934070637528)
854239
EAR99

Discontinued and Replacement Part Data

Part/12NCDiscontinuance Notice
MC10XS3412CHFK
(934070637557)
-
MC10XS3412CHFKR2
(934070637528)
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC10XS3412CHFK
(934070637557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC10XS3412CHFKR2
(934070637528)
MC10XS3412CHFK
(934070637557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC10XS3412CHFKR2
(934070637528)
MC10XS3412CHFKR2
(934070637528)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MC12XS3

The NXP 12XS3 eXtreme Switch Generation 3 12 V devices are SPI-controlled smart high side switches providing diagnostics for the switch, light source and wiring harness, as well as comprehensive fault management and control of the loads without complex software.

  • Programmable multi-step latched overcurrent shutdown protection
  • Minimizes the thermal stress within the device during an overload condition, reducing the junction temperature rise and improving reliability
  • Packaged in a PQFN package and a SOICW-EP package
  • Low RDS(ON) and large integration enable savings in module size, power dissipation and total system cost