Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
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Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
FM6F: FM6F, plastic, flange mount flat package; 6 terminals; 9.96 mm x 32.26 mm x 3.81 mm body
12NC: 935318726528
Details
Order
Parameter | Value |
---|---|
fi(RF) [max] (MHz) | 960 |
Number of pins | 6 |
Package Style | DFM |
Amp Class | AB, C |
Test Signal | WCDMA |
Supply Voltage (Typ) (V) | 28 |
Class | AB, C |
Die Technology | LDMOS |
Thermal Resistance (Spec) (℃/W) | 0.29 |
P1dB (Typ) (dBm) | 56 |
Security Status | COMPANY PUBLIC |
Frequency (Min-Max) (MHz) | 716, 960 |
Efficiency (Typ) (%) | 48 |
Peak Power (Typ) (W) | 540 |
Frequency Band (Hz) | 716000000, 960000000 |
Parameter | Value |
---|---|
Description | AIRFAST RF POWER LDMOS TRANSISTOR 716-960 MHz, 93 W AVG., 28 V |
fi(RF) [min] (MHz) | 716 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal | 93 @ AVG |
P1dB (Typ) (W) | 400 |
Gain (Typ) (dB) | 17.9 |
Power Gain (Typ) (dB) @ f (MHz) | 17.9 @ 836 |
Frequency (Max) (MHz) | 960 |
Frequency (Min) (MHz) | 716 |
Frequency (Min-Max) (GHz) | 0.716 to 0.96000004 |
frange [max] (MHz) | 960 |
frange [min] (MHz) | 716 |
Rth(j-a) (K/W) | 0.29 |
Matching | input and output impedance matching |
Modes of Operation | wideband code division multiple access |
Peak Power (Typ) (dBm) | 57.3 |
Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
A2T09D400-23NR6(935318726528) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 5284.8 |
Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
A2T09D400-23NR6 (935318726528) | No | 3 | 260 | 40 |
Part/12NC | Harmonized Tariff (US)Disclaimer |
---|---|
A2T09D400-23NR6 (935318726528) | 854233 |
Part/12NC | Issue Date | Effective Date | PCN | Title |
---|---|---|---|---|
A2T09D400-23NR6 (935318726528) | 2025-04-16 | 2025-05-26 | 202504006I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
A2T09D400-23NR6 (935318726528) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
A2T09D400-23NR6 (935318726528) | 2020-05-09 | 2020-05-10 | 202005002I | OM1230 Internal Plating Thickness Change on Package Flange/Heatsink |