202005002I : OM1230 Internal Plating Thickness Change on Package Flange/Heatsink
NXP announces an internal plating thickness change for products in the OM1230 package outline.This plating thickness change reduces the amount of Au plating internal to the package from 75u" to 60u" which optimizes the product manufacturability/consistency.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Customer Information Notification | Assembly materials | 09-May-2020 | 10-May-2020 |
Reason of Change
Optimization of internal flange plating thickness for improved manufacturing consistency.
Identification of Affected Products
Product identification does not change
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
A2T09D400-23NR6 (935318726528) |
- | - | - |
|
A2T14H450-23NR6 (935316214528) |
- | - | - |
|
A2T21H360-23NR6 (935322358528) |
- | - | - |
|
A2V07H525-04NR6 (935339924528) |
- | - | - |
|
A2V09H525-04NR6 (935330045528) |
- | - | - |