NXH2281UK: NFMI radio solution | NXP Semiconductors

NFMI Radio for Wireless Audio and Data Streaming

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Product Details

Features

Controller subsystem

  • Customer programmable Arm Cortex-M0 ultra-low-power, for system configuration and control
  • I²C-bus/SPI follower control interface
  • Flexible interfaces: UART, GPIO, SWD, SPI leader, I²C-bus controller
  • Embedded low power 512 kbit EEPROM

Magnetic induction transceiver

  • 596 kbit/s raw throughput
  • Carrier frequency of 10.579 MHz
  • On-chip tuning of coil resonator tank
  • Programmable transmit power
  • Integrated AGC
  • Operation from internal oscillator
  • Optimized protocol for low latency ear-to-ear communication
  • Embedded network protocol for up to 15 devices

Audio data path

  • I2S-bus audio interface
  • Support for multiple audio sample frequencies up to 48 kHz
  • Integrated MAC accelerator for MI radio
  • Integrated audio G.722 and ADPCM codecs for up to four audio channels
  • Integrated latency controller for two RX channels
  • Integrated adaptive sample rate converter for two RX channels
  • Integrated CoolFlux DSP with SBC codec

Power management subsystem

  • Integrated battery management supporting ZnAir or NiMH batteries
  • Integrated supply booster for transparent EEPROM operation

Power consumption

  • Supports multiple low-power modes:
    • Power-down: 5 μA
    • Deep-sleep: 8 μA
    • Sleep: 60 μA
    • Carrier detect: 100 μA
    • Mono audio streaming - receive: 1000 μA (fs = 20 kHz, G.722)
    • Mono audio streaming - transmit: 1050 μA (fs = 20 kHz, G.722)
    • Binaural audio streaming: 1300 μA (fs = 20 kHz, G.722)
    • Mono audio streaming - receive: 2400 μA (fs = 44.1 kHz, SBC)
    • Mono audio streaming - transmit: 2000 μA (fs = 44.1 kHz, SBC)
  • Support for flexible slot allocation of the radio enabling better power tuning over the different use cases
  • Integrated ultra-low-power oscillator and timer used in low-power modes

Package

  • WLCSP31 with dimensions of 2.79 mm × 3.72 mm (10.38 mm2)
  • Flexible I/O switch matrix with 14 pins
  • Configurable supply level for I/O
  • 31 bumps with a minimum pitch of 400 μm

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Ambient Operating Temperature (Min to Max) (℃)

Supply Voltage (Min) (V)

Supply Voltage (Max) (V)

Power

SNR (dBFS)

Audio Streams

Non-Volatile Memory (kbit)

Active

1 @ US$1000.00

Active

1 @ US$3000.00

Active

10K @ US$4.93

WLCSP31

-20 to 85

1

1.45

3.4

-93

Up to 4

512

N true 0 PSPNXH2281UKen 3 Application Note Application Note t789 1 Fact Sheet Fact Sheet t523 1 Package Information Package Information t790 1 en_US en_US en Application Note Application Note 1 1 5.0 English 1450281074674720655877 PSP 166.1 KB None None documents None 1450281074674720655877 /docs/en/application-note/AN11761.pdf 166137 /docs/en/application-note/AN11761.pdf AN11761 documents N N 2016-10-05 Flip chip die /docs/en/application-note/AN11761.pdf /docs/en/application-note/AN11761.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Sep 29, 2021 645036621402383989 Application Note Y N Flip chip die Fact Sheet Fact Sheet 1 2 2 English Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. 1565293859646702436251 PSP 158.9 KB None None documents None 1565293859646702436251 /docs/en/fact-sheet/MIGLOFS.pdf 158883 /docs/en/fact-sheet/MIGLOFS.pdf MIGLOFS documents N N 2019-08-08 MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf /docs/en/fact-sheet/MIGLOFS.pdf Fact Sheet N 736675474163315314 2023-06-18 pdf N en Oct 13, 2021 736675474163315314 Fact Sheet Y N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming Package Information Package Information 1 3 1.2 English 1460739226886722331330 PSP 243.0 KB None None documents None 1460739226886722331330 /docs/en/package-information/SOT1465-2.pdf 243000 /docs/en/package-information/SOT1465-2.pdf SOT1465-2 documents N 2016-04-15 wafer level chip-scale package, 31 bumps /docs/en/package-information/SOT1465-2.pdf /docs/en/package-information/SOT1465-2.pdf Package Information N 302435339416912908 2022-12-07 pdf en Apr 21, 2016 302435339416912908 Package Information Y N wafer level chip-scale package, 31 bumps false 0 NXH2281UK downloads en true 1 Y PSP Y Y Application Note 1 /docs/en/application-note/AN11761.pdf 2016-10-05 1450281074674720655877 PSP 1 Sep 29, 2021 Application Note None /docs/en/application-note/AN11761.pdf English documents 166137 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN11761.pdf Flip chip die /docs/en/application-note/AN11761.pdf documents 645036621402383989 Application Note N en None Y pdf 5.0 N N Flip chip die 166.1 KB AN11761 N 1450281074674720655877 Fact Sheet 1 /docs/en/fact-sheet/MIGLOFS.pdf 2019-08-08 1565293859646702436251 PSP 2 Oct 13, 2021 Fact Sheet Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. None /docs/en/fact-sheet/MIGLOFS.pdf English documents 158883 None 736675474163315314 2023-06-18 N /docs/en/fact-sheet/MIGLOFS.pdf MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 2 N N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming 158.9 KB MIGLOFS N 1565293859646702436251 Package Information 1 /docs/en/package-information/SOT1465-2.pdf 2016-04-15 1460739226886722331330 PSP 3 Apr 21, 2016 Package Information None /docs/en/package-information/SOT1465-2.pdf English documents 243000 None 302435339416912908 2022-12-07 /docs/en/package-information/SOT1465-2.pdf wafer level chip-scale package, 31 bumps /docs/en/package-information/SOT1465-2.pdf documents 302435339416912908 Package Information N en None Y pdf 1.2 N wafer level chip-scale package, 31 bumps 243.0 KB SOT1465-2 N 1460739226886722331330 true Y Products

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