Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
NFMI Radio for Wireless Audio and Data Streaming
Buy Options
NXH2281ADK15UL
Active
12NC: 935336056598
Details
Order
Pending Stock
Order from distributorsOperating Features
No information available
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|
NXH2281ADK15UL(935336056598) | Not Available | No Information | Not Available | No Information | 1.0 |
Quality
| Part/12NC | Safe Assure Functional Safety | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | ||
|---|---|---|---|---|---|
| Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | ||
NXH2281ADK15UL (935336056598) | No | 240 | 260 | 30 | 40 |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
NXH2281ADK15UL (935336056598) | 902300 | 5A992 |
More about NXH2281UK
Not recommended for new designs, please refer to NXH2261UK when starting a new design
The NXH2281UK is an ultra-low-power wireless single-chip solution optimized for audio and data communication. It uses a magnetic induction radio to provide a robust, tightly contained body area network around each user. It uses Near Field Magnetic Induction (NFMI) for wireless audio and data streaming.
It offers a fully integrated Arm® Cortex®-M0-based control subsystem, a Magnetic Induction (MI) transceiver, an audio data path and a power management subsystem.
In addition to the Arm Cortex-M0, the control subsystem embeds a 512 kbit EEPROM and a set of standard interfaces.
The audio data path is based on hardware-accelerated audio processing blocks and can be enhanced with a user-programmable CoolFlux DSP®. The integrated power management subsystem supports multiple power domains and runs directly from a ZnAir or NiMH battery.
The device is available in a Wafer-Level Chip-Scale (WLCSP) package.