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Reflow Soldering Profile[REFLOW_SOLDERING_PROFILE]
The BGU7224 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 2.4 GHz to 2.5 GHz ISM band. Manufactured in NXP's high performance SiGe:C technology, the BGU7224 couples gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7224 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external component, makes the circuit board implementation of the BGU7224 the smallest IEEE 802.11b/g/n (including 256 QAM enabling “802.11n turbo”) LNA with bypass solution on the market, ideal for space sensitive applications.
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BGU7224
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