2.4 GHz ISM SiGe:C Low-Noise Amplifier MMIC with Bypass | NXP Semiconductors

2.4 GHz ISM SiGe:C Low-Noise Amplifier MMIC with Bypass

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Product Details

Features

  • IEEE 802.11b/g/n WiFi, WLAN (including 256 QAM enabling “802.11n turbo”)
  • Fully integrated, high performance LNA with built-in bypass
  • Integrated DC blocking at RF input and RF output, with only one external component needed
  • Low 1.0 dB noise figure with 13 mA current consumption
  • Low bypass current of 2 μA (typical)
  • Single supply 3.0 V to 3.6 V operation
  • Integrated, temperature stabilized bias network
  • Integrated concurrent 5 GHz notch filter
  • High IP3i and low EVM
  • High ESD protection of 2 kV (HBM) on all pins
  • Small, 0.5 mm pitch, 1.6 mm x 1.6 mm x 0.5 mm QFN-style package, MSL 1 at 260 °C
  • Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) following NXP’s RHF-2006 indicator D (dark green)

Target Applications

  • IEEE 802.11b/g/n WiFi, WLAN
  • Bluetooth
  • IEEE 802.15.4 PAN
  • Smartphones, tablets, netbooks and other portable computing devices
  • Access points, routers, gateways
  • Wireless video
  • General purpose ISM applications

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N true 0 PSPBGU7224en 4 Application Note Application Note t789 1 Data Sheet Data Sheet t520 1 Package Information Package Information t790 1 Supporting Information Supporting Information t531 1 en_US en_US en Data Sheet Data Sheet 1 1 2.0 English The BGU7224 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 2.4 GHz to 2.5 GHz ISM band. 1442067911247727817814 PSP 350.6 KB None None documents None 1442067911247727817814 /docs/en/data-sheet/BGU7224.pdf 350614 /docs/en/data-sheet/BGU7224.pdf BGU7224 documents N N 2014-12-15 2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypass /docs/en/data-sheet/BGU7224.pdf /docs/en/data-sheet/BGU7224.pdf Data Sheet N 980000996212993340 2024-08-26 pdf N en Dec 15, 2014 980000996212993340 Data Sheet Y N 2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypass Application Note Application Note 1 2 2.0 English 1442087449572703584130 PSP 1.2 MB None None documents None 1442087449572703584130 /docs/en/application-note/AN11390.pdf 1246243 /docs/en/application-note/AN11390.pdf AN11390 documents N N 2016-03-18 BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNAMMIC with Bypass /docs/en/application-note/AN11390.pdf /docs/en/application-note/AN11390.pdf Application Note N 645036621402383989 2024-08-22 pdf N en Mar 18, 2016 645036621402383989 Application Note Y N BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNAMMIC with Bypass Package Information Package Information 1 3 1.1 English 1455079172479719393220 PSP 114.6 KB None None documents None 1455079172479719393220 /docs/en/package-information/SOT1189-1.pdf 114550 /docs/en/package-information/SOT1189-1.pdf SOT1189-1 documents N N 2018-08-16 DFN1616-6: plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals /docs/en/package-information/SOT1189-1.pdf /docs/en/package-information/SOT1189-1.pdf Package Information N 302435339416912908 2024-09-10 pdf N en Aug 14, 2018 302435339416912908 Package Information Y N DFN1616-6: plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals Supporting Information Supporting Information 1 4 1.0 English Reflow Soldering temperature profile 1442122749741692602431 PSP 34.6 KB None None documents None 1442122749741692602431 /docs/en/supporting-information/Reflow_Soldering_Profile.pdf 34577 /docs/en/supporting-information/Reflow_Soldering_Profile.pdf REFLOW_SOLDERING_PROFILE documents N N 2016-10-08 Reflow Soldering Profile /docs/en/supporting-information/Reflow_Soldering_Profile.pdf /docs/en/supporting-information/Reflow_Soldering_Profile.pdf Supporting Information N 371282830530968666 2024-11-28 pdf N en Feb 17, 2014 371282830530968666 Supporting Information Y N Reflow Soldering Profile false 0 BGU7224 downloads en true 1 Y PSP Application Note 1 /docs/en/application-note/AN11390.pdf 2016-03-18 1442087449572703584130 PSP 2 Mar 18, 2016 Application Note None /docs/en/application-note/AN11390.pdf English documents 1246243 None 645036621402383989 2024-08-22 N /docs/en/application-note/AN11390.pdf BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNAMMIC with Bypass /docs/en/application-note/AN11390.pdf documents 645036621402383989 Application Note N en None Y pdf 2.0 N N BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNAMMIC with Bypass 1.2 MB AN11390 N 1442087449572703584130 Data Sheet 1 /docs/en/data-sheet/BGU7224.pdf 2014-12-15 1442067911247727817814 PSP 1 Dec 15, 2014 Data Sheet The BGU7224 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 2.4 GHz to 2.5 GHz ISM band. None /docs/en/data-sheet/BGU7224.pdf English documents 350614 None 980000996212993340 2024-08-26 N /docs/en/data-sheet/BGU7224.pdf 2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypass /docs/en/data-sheet/BGU7224.pdf documents 980000996212993340 Data Sheet N en None Y pdf 2.0 N N 2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypass 350.6 KB BGU7224 N 1442067911247727817814 Package Information 1 /docs/en/package-information/SOT1189-1.pdf 2018-08-16 1455079172479719393220 PSP 3 Aug 14, 2018 Package Information None /docs/en/package-information/SOT1189-1.pdf English documents 114550 None 302435339416912908 2024-09-10 N /docs/en/package-information/SOT1189-1.pdf DFN1616-6: plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals /docs/en/package-information/SOT1189-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.1 N N DFN1616-6: plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals 114.6 KB SOT1189-1 N 1455079172479719393220 Supporting Information 1 /docs/en/supporting-information/Reflow_Soldering_Profile.pdf 2016-10-08 1442122749741692602431 PSP 4 Feb 17, 2014 Supporting Information Reflow Soldering temperature profile None /docs/en/supporting-information/Reflow_Soldering_Profile.pdf English documents 34577 None 371282830530968666 2024-11-28 N /docs/en/supporting-information/Reflow_Soldering_Profile.pdf Reflow Soldering Profile /docs/en/supporting-information/Reflow_Soldering_Profile.pdf documents 371282830530968666 Supporting Information N en None Y pdf 1.0 N N Reflow Soldering Profile 34.6 KB REFLOW_SOLDERING_PROFILE N 1442122749741692602431 true Y Products

Documentation

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4 documents

Compact List

Application Note (1)
Data Sheet (1)
Package Information (1)
Supporting Information (1)

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