Ultra-thin contactless chip module MOB10 | NXP Semiconductors

Ultra-Thin Contactless Chip Module MOB10

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Product Details

Features

  • Thin and flexible inlays for 600μm eDatapage or eCover
  • Enables additional security layers and is optimized for polycarbonate technology
  • Improved robustness and product quality
  • High production efficiency building on proven MOB platforms
  • Total package thickness: 200 μm
  • Leadframe thickness: 35 μm
  • Improved leadframe material with Ag plating
  • Compatible to MOB4/6 production lines
N true 0 PSPMOB10en 1 Fact Sheet Fact Sheet t523 1 en_US en_US en Fact Sheet Fact Sheet 1 1 1 English Ultra-thin module transforms ePassport and eID card production 1508129489572721627623 PSP 49.6 MB None None documents None 1508129489572721627623 /docs/en/fact-sheet/MOB10-leaflet.pdf 49572529 /docs/en/fact-sheet/MOB10-leaflet.pdf MOB10FS documents N N 2017-10-15 NXP Ultra-Thin Contactless Chip Module MOB10 /docs/en/fact-sheet/MOB10-leaflet.pdf /docs/en/fact-sheet/MOB10-leaflet.pdf Fact Sheet N 736675474163315314 2025-03-08 pdf N en Oct 15, 2017 736675474163315314 Fact Sheet Y N NXP Ultra-Thin Contactless Chip Module MOB10 false 0 MOB10 downloads en true 1 Y PSP Y Y Fact Sheet 1 /docs/en/fact-sheet/MOB10-leaflet.pdf 2017-10-15 1508129489572721627623 PSP 1 Oct 15, 2017 Fact Sheet Ultra-thin module transforms ePassport and eID card production None /docs/en/fact-sheet/MOB10-leaflet.pdf English documents 49572529 None 736675474163315314 2025-03-08 N /docs/en/fact-sheet/MOB10-leaflet.pdf NXP Ultra-Thin Contactless Chip Module MOB10 /docs/en/fact-sheet/MOB10-leaflet.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 1 N N NXP Ultra-Thin Contactless Chip Module MOB10 49.6 MB MOB10FS N 1508129489572721627623 true Y Products

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