End-to-End Services | NXP Semiconductors

Automotive

Industrial

Consumer

Technologies

End-to-End Services

JCOP® ID and JCOP® Pay offer turnkey solutions for payment and eGovernment use cases.

JCOP solutions are optimized for use with NXP's SmartMX® family and support convergence of various smart city services like identification, payment and transport solutions.

JCOP Solutions

Products Description Applications
JCOP ID JCOP ID 1
  • Common criteria certified EAL 6+
  • Compliant with the latest EU Regulation 2019/1157 mandates
  • Supports multi-application use cases
  • Dedicated experts for smooth implementation
  • Everything is in one place: hardware, software and expertise
JCOP ID 2
JCOP Pay
  • Common criteria EAL 6+ EMVCo™ certified
  • Supports convergence of payment with transport and eGov applications
  • Leading performance (<200 mls)
  • Easy implementation with full range of certified applets
  • Contact, dual interface and contactless payment cards
  • Other contactless payment form factors, e.g. wearables, key fobs

Key Features

Standardization

JCOP ID products are Common Criteria EAL 6+ certified and comply with EU Reg 2019/1157.

Security

JCOP ID products provide end-to-end protections, including support for authentication and electronic document signature use cases.

Sustainability

Robust hardware, field updatable software and NFC connectivity for easy expansion to online services are enabled by JCOP products.

Strength

JCOP products provide the confidence that comes from using a turnkey solution that's been deployed in dozen of real-world applications.

Target Applications

Smart Cities

Design Resources

Smart Cities: Identification

  • Training

Learn the definition, benefits and challenges of identification applications such as governmental eDocuments, mobile identification and smart papers.

Smart Cities: Payment

  • Training

Learn everything about NXP payment products such as MIFARE, mWallet2GO and JCOP and complete solutions for secure POS terminals.

SmartMX3 Introduction

  • Video

Learn more about SmartMX3, our high-attack resilient are proveen solution for contact, contacless and dual-interface applications.

Additional Documents

Smart and Secure Identity Services

Protection, flexibility and simplicity from the leader in identification.

NXP® Ultra-Thin Contactless Chip Module MOB10

Measuring just 200 µm, the MOB10 is ideally suited for use in ultra-thin inlays for passport data pages and identity cards.