202306009F01 : DIE ATTACH GLUE CHANGE DUE TO HENKEL 8388A DISCONTINUATION

The die attach glue used between the chip and lead frame in chip on lead frame packaging serves as a bonding material to securely attach the chip to the lead frame. This die attach adhesive is changed from Henkel LOCTITE ABLESTIK 8388A to Henkel LOCTITE ABLESTIK QMI550 for all MOA4 and MOA8 modules. There are no changes to the form fit and function of the MOA4 and MOA8 modules due to the changeover to the new die attach glue from the same supplier. The revised module continues to offer the same high-quality performance and reliability standards. Attached to this notification you will find the Qualification Report which outlines the qualification results and criteria for the revised modules.

Reason of Change

The existing die attach glue has been discontinued by our supplier in December 2022. NXP could arrange enough die attach glue to be able to produce until December 2023. The new qualified die attach glue from Henkel LOCTITE ABLESTIK QMI550 will be used in production after depletion of the existing stock of Henkel LOCTITE ABLESTIK 8388A.

Anticipated Impact

Data sheet revision: No impact to existing datasheet

Affected Parts