202306009A : DIE ATTACH GLUE CHANGE DUE TO HENKEL 8388A DISCONTINUATION

The die attach glue used between the chip and lead frame in chip on lead frame packaging serves as a bonding material to securely attach the chip to the lead frame. This die attach adhesive is changed from Henkel LOCTITE ABLESTIK 8388A to Henkel LOCTITE ABLESTIK ABP 2035SCR for all MOA4 and MOA8 packages. There are no changes to the form fit and function of the MOA4 and MOA8 modules due to the changeover to the new die attach glue. The revised module continues to offer the same high-quality performance and reliability and complies with REACH standards. Attached to this notification you will find the Qualification Plan which outlines the qualification procedures and criteria for the revised module.

Reason of Change

The existing die attach glue has been discontinued by our supplier in December 2022. NXP could arrange enough die attach glue to be able to produce until November 2023.

Anticipated Impact

Data sheet revision: No impact to existing datasheet

Affected Parts