SPC5673KF0VMM1 Product Information|NXP

Features


NXP 32-bit MCU, Dual Power Arch, 1MB Flash, 150MHz, -40/+105degC, Automotive Qual, MAPBGA 257

Package


LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

Buy Options

Operating Features

ParameterValue
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Dual Power Arch, 1MB Flash, 150MHz, -40/+105degC, Automotive Qual, MAPBGA 257
ParameterValue
Number of pins
257
Package Style
LFBGA

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
SPC5673KF0VMM1R(935310915518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
407.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SPC5673KF0VMM1R
(935310915518)
Quality Managed
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
SPC5673KF0VMM1R
(935310915518)
854231
3A991A2

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
SPC5673KF0VMM1R
(935310915518)
NOTICE
2020-11-30
2021-11-30
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5673KF0VMM1R
(935310915518)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5673KF0VMM1R
(935310915518)
2020-03-202020-03-21201908018DNU01Cancellation of Discontinuation Notification For MPC5675K 257MAPBGA With 0.7mm Mold Cap Height
SPC5673KF0VMM1R
(935310915518)
2019-12-032019-12-04201908018DNDiscontinuation Notification For MPC5675K 257MAPBGA With 0.7mm Mold Cap Height
SPC5673KF0VMM1R
(935310915518)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC567xK

The MPC567xK family of MCUs offers a compelling, low-cost solution for advanced driver assistance systems (ADAS). They are designed to handle industrial and automotive applications such as adaptive cruise control, smart headlamp control, lane departure warning and blind-spot detection.

  • Minimizes additional software and module level features through on-chip redundancy
  • Reduces system component and development costs
  • Comprehensive development tools simplify and accelerate system design
  • Part of the SafeAssure® program, helping manufacturers achieve functional safety standard compliance