Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Sign in for a personalized NXP experience.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
GSM/GSM EDGE, SINGLE N-CDMA, 2 x W-CDMA Lateral N-Channel RF Power MOSFET, 1600-2200 MHz, 10 W, 28 V
12NC: 935320363528
Details
Order
Parameter | Value |
---|---|
fi(RF) [max] (MHz) | 2200 |
Number of pins | 2 |
Package Style | DFM |
Amp Class | AB |
Test Signal | WCDMA |
Supply Voltage (Typ) (V) | 28 |
Class | AB |
Die Technology | LDMOS |
Thermal Resistance (Spec) (℃/W) | 2.3 |
P1dB (Typ) (dBm) | 40 |
Security Status | COMPANY PUBLIC |
Frequency (Min-Max) (MHz) | 1600, 2200 |
Efficiency (Typ) (%) | 15 |
Peak Power (Typ) (W) | 14 |
Frequency Band (Hz) | 1600000000, 2200000000 |
Intermodulation Distortion - IMD (Typ) (dBc) | -47 |
Parameter | Value |
---|---|
Description | GSM/GSM EDGE, SINGLE N-CDMA, 2 x W-CDMA Lateral N-Channel RF Power MOSFET, 1600-2200 MHz, 10 W, 28 V |
fi(RF) [min] (MHz) | 1600 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal | 1 @ AVG |
P1dB (Typ) (W) | 10 |
Gain (Typ) (dB) | 15.5 |
Power Gain (Typ) (dB) @ f (MHz) | 15.5 @ 2170 |
Frequency (Max) (MHz) | 2200 |
Frequency (Min) (MHz) | 1600 |
Frequency (Min-Max) (GHz) | 1.6 to 2.2 |
frange [max] (MHz) | 2200 |
frange [min] (MHz) | 1600 |
Rth(j-a) (K/W) | 2.3 |
Matching | input impedance matching |
Modes of Operation | wideband code division multiple access |
Intermodulation Distortion - IM3 (Typ) (dBc) | -47 |
Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
MMRF1004GNR1(935320363528) | No | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 548.0 |
Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
Lead Soldering | Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | |||
MMRF1004GNR1 (935320363528) | No | 3 | 260 | 260 | 40 | 40 |
Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
---|---|---|
MMRF1004GNR1 (935320363528) | 854233 | EAR99 |
Part/12NC | Issue Date | Effective Date | PCN | Title |
---|---|---|---|---|
MMRF1004GNR1 (935320363528) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |