Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
i.MX 7Solo Processors - Heterogeneous Processing with Arm® Cortex®-A7 and Cortex-M4 Cores
Buy Options
MCIMX7S3DVK08SD
Active
12NC: 935351918557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Core: Number of cores (SPEC) | 1 |
Core Type | Arm Cortex-A7 |
Operating Frequency [Max] (MHz) | 800 |
L2 Cache (Max) (KB) | 512 |
SRAM (kB) | 256 |
External Memory Supported | DDR3 SDRAM, DDR3L SDRAM, ECC, LPDDR2 DRAM, LPDDR3 DRAM, NAND FLASH, NOR FLASH, QSPI |
| Parameter | Value |
|---|---|
Video/Display features | MIPI-CSI, MIPI-CSI-2, MIPI-DSI, PCP |
USB Controllers | 2 |
Serial Communication | 4 x I²C, 4 x SPI, 7 x UART |
Audio Specific Modules | SAI |
Junction Temperature (Min) (℃) | 0 |
Junction Temperature (Max) (℃) | 95 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MCIMX7S3DVK08SD(935351918557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 261.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MCIMX7S3DVK08SD (935351918557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
MCIMX7S3DVK08SD (935351918557) | 854231 | 5A992 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MCIMX7S3DVK08SD (935351918557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MCIMX7S3DVK08SD (935351918557) | 2023-04-13 | 2023-04-14 | 202303017I | iMX7DS Errata update to Rev 1.2/1.1 for MaskSet 3N09P/2N09P |
MCIMX7S3DVK08SD (935351918557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCIMX7S3DVK08SD (935351918557) | 2019-03-27 | 2019-03-28 | 201902017I | i.MX 7Dual/Solo Data Sheet Update to Rev6 |
MCIMX7S3DVK08SD (935351918557) | 2018-04-14 | 2018-04-15 | 201803016I | Errata Update for i.MX7DS 3N09P Rev 1.0 |
MCIMX7S3DVK08SD (935351918557) | 2017-07-30 | 2017-07-31 | 201707032I | i.MX7D/S Datasheet Update Rev 5 |
More about i.MX7S
The i.MX 7Solo family of processors represents our latest achievement in high-performance processing for low-power requirements with a high degree of functional integration. These processors are targeted towards the growing market of connected devices. The i.MX 7Solo family of processors features our advanced implementation of the Arm® Cortex®-A7 core, which operates at speeds of up to 1 GHz, as well as the Arm Cortex-M4 core. The i.MX 7Solo family supports multiple memory types including 16/32-bit DDR3L/LPDDR2/LPDDR3-1066, Quad SPI memory, NAND, eMMC and NOR. Several high-speed connectivity connections include Gigabit Ethernet with AVB and USB. Both parallel and serial Display and Camera interfaces are provided.
i.MX 7 applications processors are part of NXP's EdgeVerse™ edge computing platform.