Getting Started with the FRDMGD3162HBIEVM Evaluation Board | NXP Semiconductors

Getting Started with the FRDMGD3162HBIEVM Evaluation Board

Last Modified: 2022-03-03 17:16:00Supports FRDMGD3162HBIEVM

Contents of this document

  • 1

    Out of the Box
  • 2

    Get to Know the Hardware
  • 3

    Install Software
  • 4

    Configure Hardware

1. Out of the Box

The NXP analog product development boards provide an easy-to-use platform for evaluating NXP products. The boards support a range of analog, mixed-signal and power solutions. They incorporate monolithic integrated circuits and system-in-package devices that use proven high-volume technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost and improved performance in powering state-of-the-art systems.

This page will guide you through the process of setting up and using the FRDMGD3162HBIEVM board.

1.1 Kit Contents and Packing List

The FRDMGD3162HBIEVM contents include:

  • Assembled and tested FRDMGD3162HBIEVM board in an anti-static bag
  • 3.3 V to 5.0 V translator board (KITGD316XTREVB) connected to FRDM-KL25Z
  • USB cable type A male / type mini-B male, 3 ft
  • Quick Start Guide
  • 1.2 Additional Hardware

    In addition to the kit contents, the following hardware is necessary or beneficial when working with this board.

    • Compatible HybridPACK™ Drive insulated gate bipolar transistor (IGBT) or SiC metal-oxide-semiconductor field-effect transistor (MOSFET) module
    • DC link capacitor compatible with the HybridPACK drive module
    • 1.27 mm jumpers for configuration (included with kit)
    • 30 µH to 50 µH, high current air core inductor for double pulse testing
    • HV power supply with protection shield and hearing protection
    • 20 V, 1.0 A DC power supply
    • 500 MHz, 2.5 GS/s, 4-channel oscilloscope
    • Rogowski coil, PEM Model CWT Mini HF60R or CTW MiniHF30 (smaller diameter)
    • Isolated high-voltage probes
    • Digital voltmeter

    1.3 Windows PC Workstation

    The kit requires the following to function properly with the software:

    • Windows 7 or higher operating system

    1.4 Software

    Installing software is necessary to work with this half-bridge evaluation kit. All listed software is available at FRDMGD3162HBIEVM Half-Bridge Evaluation Kit.

    • FlexGUI software for using with KITGD316XTREVB MCU/translator board

    2. Get to Know the Hardware

    2.1 Board Features

    • Capability to connect to HybridPACK Drive module for half-bridge evaluations
    • Adjustable negative VEE gate low drive level (0 V to -10 V DC)
    • Adjustable VCC gate high drive level (10 V to 25 V DC)
    • Jumper configurable for disabling dead time fault protection when short-circuit testing
    • Easy access to power, ground and signal test points
    • Easy to install and use FlexGUI for interfacing via SPI through PC; software includes double pulse and short-circuit testing capability
    • DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
    • Negative or positive temperature coefficient connection and configurable for monitoring module temperature

    2.2 Board Description

    The FRDMGD3162HBIEVM is a half-bridge evaluation kit populated with two GD3162 single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller hardware for interfacing a PC installed with FlexGUI software for communication to the serial peripheral interface (SPI) registers on the GD3162 gate drive devices in either daisy chain or standalone configuration.

    The KITGD316XTREVB translator board is used to translate 3.3 V signals to 5.0 V signals between the MCU and GD3162 gate drivers. The evaluation kit can be connected to a compatible IGBT or SiC module for half-bridge evaluations and applications development.

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    GS-FRDMGD3162HBIEVM-aaa-044975

    2.3 Board Components

    Overview of the FRDMGD3162HBIEVM board.

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    GS-FRDMGD3162HBIEVM-aaa-044976

    Kinetis KL25Z Freedom Board

    The Freedom KL25Z is an ultra low-cost development platform for Kinetis L series MCU built on Arm Cortex-M0+ processor.

    GS-FRDMGD3162HBIEVM-aaa-039272

    GS-FRDMGD3162HBIEVM-aaa-039272

    3.3 V to 5.0 V Translator Board

    KITGD316XTREVB translator enables level shifting of signals from MCU 3.3 V to 5.0 V SPI communication.

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    GS-FRDMGD3162HBIEVM-aaa-042925
    Jumper Position Function
    VCCSEL (J3) 1-2 Selects 5.0 V for 5.0 V compatible gate drivers.
    2-3 Selects 3.3 V for 3.3 V compatible gate drivers.
    PWMH_SEL (J4) 1-2 Selects PWM high-side control from KL25Z MCU.
    2-3 Selects PWM high-side control from fiber optic receiver inputs.
    PWML_SEL (J5) 1-2 Selects PWM low-side control from KL25Z MCU.
    2-3 Selects PWM low-side control from fiber optic receiver inputs.

    3. Install Software

    Software for FRDMGD3162HBIEVM is distributed with the FlexGUI tool (available at nxp.com). Necessary firmware comes pre-installed on the FRDM-KL25Z with the kit.

    Even if the user intends to test with other software or PWM, it is recommended to install this software as a backup or to help debug.

    3.1 Install FlexGUI On Your Computer

    The latest version of FlexGUI supports the GD3100, GD3160 and GD3162. It is designed to run on any Windows 10 or Windows 8 based operating system.

    1. Go to FlexGUI Software and click "Download"
    2. When the FlexGUI software page appears, click "Download" and select the version associated with your PC operating system
    3. FlexGUI wizard creates a shortcut and an NXP FlexGUI icon appears on the desktop. By default, the FlexGUI executable file is installed at C:\flexgui-app-des-gd31xx.exe. Installing the device drivers overwrites any previous FlexGUI installation and replaces it with a current version containing the GD31xx drivers. However, configuration files (.spi) from the previous version remain intact

    4. Configure Hardware

    4.1 Configure the Hardware

    FRDMGD3162HBIEVM is connected to a compatible SiC MOSFET HybridPACK Drive module with a DC link capacitor. Double pulse and short-circuit testing can be conducted using a Windows based PC with FlexGUI software.

    Suggested equipment needed for test:

    • Rogowski coil high-current probe
    • High-voltage differential voltage probe
    • High sample rate digital oscilloscope with probes
    • DC link capacitor compatible with HybridPACK Drive module
    • IGBT or SiC MOSFET HybridPACK Drive module
    • Windows-based PC
    • High-voltage DC power supply for DC link voltage
    • Low-voltage DC power supply for VSUP +12 V DC gate drive board low-voltage domain
    • Voltmeter for monitoring high-voltage DC link supply
    • Load coil for double pulse testing

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    GS-FRDMGD3162HBIEVM-aaa-044983