A3G26H502W17S|2496-2690 MHz, 80 W Avg, 48 V | NXP Semiconductors

2496-2690 MHz, 80 W Avg., 48 V Airfast® RF Power GaN Transistor

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Product Details

Features

  • High terminal impedances for optimal broadband performance
  • Advanced high performance in-package Doherty
  • Improved linearized error vector magnitude with next generation signal
  • Able to withstand extremely high output VSWR and broadband operating conditions
  • RoHs compliant

RF Performance Table

2600 MHz

Typical Doherty Single-Carrier W-CDMA Characterization Performance: VDD = 48 Vdc, IDQA = 370 mA, VGSB = -4.6 Vdc, Pout = 80 W Avg., Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF. (1)
Frequency Gps
(dB)
ηD
(%)
Output PAR
(dB)
ACPR
(dBc)
2496 MHz14.448.47.8-32.6
2590 MHz15.049.38.2-35.2
2690 MHz14.851.27.8-34.0
1. All data measured in fixture with device soldered to heatsink.

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Status

Frequency (Min) (MHz)

Frequency (Max) (MHz)

Supply Voltage (Typ) (V)

Peak Power (Typ) (dBm)

Peak Power (Typ) (W)

Die Technology

End of Life

2496

2690

48

57

500

GaN

N true 0 PSPA3G26H502W17Sen 2 Application Note Application Note t789 1 Data Sheet Data Sheet t520 1 en_US en_US en Data Sheet Data Sheet 1 1 1 English A3G26H502W17S 2496-2690 MHz, 80 W Avg, 48 V Airfast<sup>&reg;</sup> RF power GaN transistor for cellular base stations 1607022695794699030517 PSP 349.3 KB None None documents None 1607022695794699030517 /docs/en/data-sheet/A3G26H502W17S.pdf 349302 /docs/en/data-sheet/A3G26H502W17S.pdf A3G26H502W17S documents N N 2020-12-03 A3G26H502W17S 2496-2690 MHz, 80 W Avg, 48 V Data Sheet /docs/en/data-sheet/A3G26H502W17S.pdf /docs/en/data-sheet/A3G26H502W17S.pdf Data Sheet N 980000996212993340 2022-12-07 pdf N en Jan 20, 2021 980000996212993340 Data Sheet Y N A3G26H502W17S 2496-2690 MHz, 80 W Avg, 48 V Data Sheet Application Note Application Note 1 2 1 English The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). S989356392744 PSP 664.6 KB None None documents None S989356392744 /docs/en/application-note/AN1908.pdf 664592 /docs/en/application-note/AN1908.pdf AN1908 documents N N 2016-10-31 AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf /docs/en/application-note/AN1908.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Feb 24, 2011 645036621402383989 Application Note Y N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages false 0 A3G26H502W17S downloads en true 1 Y PSP Application Note 1 /docs/en/application-note/AN1908.pdf 2016-10-31 S989356392744 PSP 2 Feb 24, 2011 Application Note The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). None /docs/en/application-note/AN1908.pdf English documents 664592 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN1908.pdf AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages 664.6 KB AN1908 N S989356392744 Data Sheet 1 /docs/en/data-sheet/A3G26H502W17S.pdf 2020-12-03 1607022695794699030517 PSP 1 Jan 20, 2021 Data Sheet A3G26H502W17S 2496-2690 MHz, 80 W Avg, 48 V Airfast<sup>&reg;</sup> RF power GaN transistor for cellular base stations None /docs/en/data-sheet/A3G26H502W17S.pdf English documents 349302 None 980000996212993340 2022-12-07 N /docs/en/data-sheet/A3G26H502W17S.pdf A3G26H502W17S 2496-2690 MHz, 80 W Avg, 48 V Data Sheet /docs/en/data-sheet/A3G26H502W17S.pdf documents 980000996212993340 Data Sheet N en None Y pdf 1 N N A3G26H502W17S 2496-2690 MHz, 80 W Avg, 48 V Data Sheet 349.3 KB A3G26H502W17S N 1607022695794699030517 true Y Products

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