201707002F01 : MCF5225X Fab Site Expansion (TSMC3 to NXP-CHD)
NXP Semiconductors is announcing the qualification of the NXP Chandler Arizona USA (NXP-CHD) wafer fabrication facility as a dual source wafer manufacturing location for the MCF5225X.The current mask set for product sourced out of TSMC3 Fab is identified as 1M42N.The new mask set for product sourced out of NXP-CHD Fab is identified as 0N18K.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Wafer fab location | 24-Aug-2017 | 21-Nov-2017 |
Reason of Change
The Fab manufacturing site capacity expansion to NXP-CHD will improve NXP's ability to meet increasing customer demand and maintain supply.
Identification of Affected Products
Top side marking The mask set marking for product sourced out of TSMC3 Fab is 1M42N. The mask set marking for product sourced out of NXP-CHD Fab is 0N18K.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
There is no change to product form fit function or reliability.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MCF52252AF80 (935309314557) |
- | - | - |
|
MCF52252CAF66 (935309315557) |
- | - | - |
|
MCF52254AF80 (935309316557) |
- | - | - |
|
MCF52254CAF66 (935322567557) |
- | - | - |
|
MCF52255CAF80 (935309317557) |
- | - | - |
|
MCF52256AG80 (935310011557) |
- | - | - |
|
MCF52256CAG66 (935321329557) |
- | - | - |
|
MCF52256CVN66 (935313986557) |
- | - | - |
|
MCF52258AG80 (935317009557) |
- | - | - |
|
MCF52258CAG66 (935314016557) |
- | - | - |
|
MCF52258CVN66 (935313987557) |
- | - | - |
|
MCF52258CVN66J (935324336557) |
- | - | - |
|
MCF52258VN80 (935313988557) |
- | - | - |
|
MCF52259CAG80 (935309895557) |
- | - | - |
|
MCF52259CVN80 (935319401557) |
- | - | - |
|
MCF52264AF80 (935323051557) |
- | - | - |