Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
ARM 32-bit MCU, Triple core, 3MB Flash, 1.3MB gRAM, 1MB sysRAM, -40/+105degC, 516 MAPBGA
Package
BGA516: BGA516, plastic, ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 1.83 mm body
Buy Options
SAC57D53MCVMO
End of Life
12NC: 935318864557
Details
Order
SAC57D53MCVMOR
End of Life
12NC: 935318864518
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Core Type | Arm Cortex-A5, Arm Cortex-M0+ IOP, Arm Cortex-M4 |
Operating Frequency [Max] (MHz) | 320 |
RAM (kB) | 1300 |
| Parameter | Value |
|---|---|
Flash (kB) | 3000 |
CAN | 3 |
SPI | 5 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
SAC57D53MCVMO(935318864557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 2911.1 |
SAC57D53MCVMOR(935318864518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e2 | REACH SVHC | 2911.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
SAC57D53MCVMO (935318864557) | No | 3 | 260 | 40 | |||
SAC57D53MCVMOR (935318864518) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | CCATS |
|---|---|---|---|
SAC57D53MCVMO (935318864557) | 854231 | 5A992C | G173437 |
SAC57D53MCVMOR (935318864518) | 854231 | 5A992C | G173437 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SAC57D53MCVMO (935318864557) | 2025-04-16 | 2025-05-26 | 202504009I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
SAC57D53MCVMOR (935318864518) | ||||
SAC57D53MCVMO (935318864557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SAC57D53MCVMOR (935318864518) | ||||
SAC57D53MCVMO (935318864557) | 2020-03-12 | 2020-06-10 | 202002004F01 | SAC57D54H/53M/52L Die Thickness Increase to 280um For The 516MAPBGA 27*27 |
SAC57D53MCVMOR (935318864518) |
More about MAC57D5xx
The MAC57D5xx MCU family is a multi-core architecture solution for mid-range instrument cluster and industrial applications. This MCU is based on the Arm® Cortex®-M processor for real-time and Cortex-A processors for applications and human-machine interfaces that offer high performance and scalability.
The MAC57D5xx MCU supports up to 2 WVGA resolution displays, one with in line head-up display hardware warping. The graphics content is generated using a powerful Vivante 2D GPU and the 2D animation and composition engine, to reduce memory footprint for content creation, integrated stepper motor drivers and a powerful I/O processor.
The MAC57D5xx MCU integrates NXP's latest SHE-compliant CSE2 engine and delivers support ISO26262 ASIL B functional safety compliance.
Now available MAC57D5x Linux and FreeRTOS software enablement package delivered by Mobiliya.