202002004F01 : SAC57D54H/53M/52L Die Thickness Increase to 280um For The 516MAPBGA 27*27
NXP Semiconductors announces a change in die thickness for the SAC57D54H/ 53M/ 52L Mask Set N87P from the current 179um to 280um.The above change coincides with DeQuMa ID: SEM-PW-03.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly process | 12-Mar-2020 | 10-Jun-2020 |
Reason of Change
Die thickness increase is to improve product quality reliability and C55 product family standardization.
Identification of Affected Products
Product identification does not change
Anticipated Impact
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
SAC57D53MCVMO (935318864557) |
- | - | - |
|
SAC57D53MCVMOR (935318864518) |
- | - | - |
|
SAC57D54HCVMO (935313269557) |
- | - | - |
|
SAC57D54HCVMOR (935313269518) |
- | - | - |