MPC8568VTAUJJ Product Information|NXP

Features


PowerQUICC, 32 Bit Power Architecture SoC, 1.3GHz, GbE, SRIO, PCIe, DDR2, TSEC, QE, 0-105C

Package


BGA1023: BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.75 mm body

Buy Options

Operating Features

ParameterValue
Security Status
COMPANY PUBLIC
Description
PowerQUICC, 32 Bit Power Architecture SoC, 1.3GHz, GbE, SRIO, PCIe, DDR2, TSEC, QE, 0-105C
ParameterValue
Number of pins
1023
Package Style
BGA

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MPC8568VTAUJJ(935322933557)
No
Yes
Certificate Of Analysis (CoA)
Yes
H
e2
REACH SVHC
6225.7

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Free SolderingLead SolderingLead Free Soldering
MPC8568VTAUJJ
(935322933557)
No
3
260
260
40
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MPC8568VTAUJJ
(935322933557)
854231
5A992

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery Date
MPC8568VTAUJJ
(935322933557)
-
2017-03-01
2017-09-01

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MPC8568VTAUJJ
(935322933557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC8568VTAUJJ
(935322933557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC8568E

Archived content is no longer updated and is made available for historical reference only.

The MPC8568E PowerQUICC® III family is designed to address the increasing performance requirements for broadband access equipment including 3G/WiMAX/LTE base stations, RNCs, gateways and ATM/TDM/IP equipment. The MPC8568E enables both IP and multi-protocol solutions, combining a high-performance e500 processor core built on Power Architecture® technology scaling up to 1.33 GHz, a flexible communications engine and high-speed system interfaces, enabling customers to handle many functions in a single-chip solution that otherwise would require multiple devices. This high level of integration provides savings in cost, power and board space.

The MPC8568E provides multiprotocol support for both protocol termination and interworking for a wide range of communication protocols, including ATM, POS, ethernet, PPP, HDLC and TDM—allowing the flexibility necessary for broadband access devices. Two enhanced Gigabit Ethernet (GbE) ports, PCI Express® and Serial RapidIO® interconnect technology, enable high-speed links to industrywide switches, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs) and digital signal processors (DSPs). An integrated security engine supports common encryption algorithms, including the Kasumi algorithm needed for 3G wireless security.

MPC8568E Processors
The MPC8568E family consists of the MPC8568E and the MPC8567E. Both are offered in a 1023-pin FC-BGA package for pin compatibility.

MPC8568E PROCESSOR HIGHLIGHTS
 
MPC8568E
MPC8567E
Core
e500
e500
CPU Speed
1.0, 1.2, 1.33 GHz
800 MHz, 1.0, 1.2, 1.33 GHz
L1 I/D Cache (KB)
32
32
L2 Cache (KB)
512
512
Memory Controller
64-bit DDR/DDR2
64-bit DDR/DDR2
Local Bus
32-bit
32-bit
System Interfaces
sRIO, PCI, PCI Express® (x8)
sRIO, PCI, PCI Express® (x4)
Stand-Alone 10/100/1000 Ethernet
2 (eTSEC)
--
Table Lookup Unit (TLU)
Yes
No
QUICC Engine™
Up to 533 MHz
Up to 533 MHz
   Ethernet
3 x Gigabit, 8 x 10/100
3 x Gigabit, 8 x 10/100
   ATM (AAL0,1,2,5)
2 x UTOPIA-L2, 124 M-PHY
2 x UTOPIA-L2, 124 M-PHY
   Packet over SONET (POS)
2 x POSPHY-L2
2 x POSPHY-L2
   8 TDMs (256 channels of HDLC)
8 x T1/E1, 2 x T3/E3
8 x T1/E1, 2 x T3/E3
   Protocol Interworking
Yes
Yes
Security Engine
SEC 2.4
SEC 2.4
Additional Interfaces
DUART, 2 x I2C, 2 x SPI
DUART, 2 x I2C, 2 x SPI
Interrupt Controller
Yes
Yes
Package
1023 FC-BGA
1023 FC-BGA

Key Advantages

  • High level of integration and performance, simplifying board design
  • Consistent programming model across the PowerQUICC III family of processors
  • Flexible system-on-chip (SoC) platform can help improve time to market
  • 90 nm silicon-on-insulator (SOI) technology
  • High-performance enhanced e500 core
    • 512 KB L2 cache
    • High internal processing bandwidth
  • Integrated DDR/DDR2 memory controller
  • Two integrated triple speed Ethernet controllers (enhanced TSEC)
  • Advanced QUICC Engine® technology supports a wide range of protocols and associated interworking
  • TLU provides off-load for table search functions associated with IP forwarding, firewall and access control list (ACL) applications
  • Flexible high-speed interconnect interfaces:
    • Serial RapidIO® interconnect technology
    • PCI Express® support
  • PCI and local bus interface support
  • Integrated security engine

Access to the errata document for this device requires an NDA. Contact your local NXP® Sales Office or NXP Authorized Distributor.

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