Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
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Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
PowerQUICC, 32 Bit Power Architecture, 333MHz, Comms Processor, PCI, USB, HDLC, Enet, -40 to 105C
LBGA480: LBGA480, plastic, low profile ball grid array; 480 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body
12NC: 935319173557
Details
Order
Parameter | Value |
---|---|
Core Type | 603e |
Operating Frequency [Max] (MHz) | 333 |
External Memory Supported | EPROM, SDRAM, SRAM |
Parameter | Value |
---|---|
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Ethernet Type | 10/100 BaseT |
Part/12NC | PbFree | EU RoHS | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|
MPC8270CZUQLDA(935319173557) | No | No | e0 | REACH SVHC | 10627.2 |
Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
Lead Soldering | Lead Soldering | Lead Soldering | |||||
MPC8270CZUQLDA (935319173557) | No | 4 | 260 | 40 |
Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | Footprint | Capture Symbol |
---|---|---|---|---|
MPC8270CZUQLDA (935319173557) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
Part/12NC | Discontinuance Notice |
---|---|
MPC8270CZUQLDA (935319173557) | - |
Part/12NC | Issue Date | Effective Date | PCN | Title |
---|---|---|---|---|
MPC8270CZUQLDA (935319173557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MPC8270CZUQLDA (935319173557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
Introducing the next generation of PowerQUICC® II™ processors: the MPC8270, MPC8275 and MPC8280.
Utilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.
The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Our PowerQUICC II processors include a high-performance embedded 603e™ core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.
A range of performance and package options
Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.
The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.