MPC8270CZUQLDA Product Information|NXP

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MPC8270CZUQLDA

End of Life

12NC: 935319173557

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Operating Features

ParameterValue
Core Type
603e
Operating Frequency [Max] (MHz)
333
External Memory Supported
EPROM, SDRAM, SRAM
ParameterValue
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105
Ethernet Type
10/100 BaseT

Environmental

Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MPC8270CZUQLDA(935319173557)
No
No
N
e0
REACH SVHC
10627.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Soldering
MPC8270CZUQLDA
(935319173557)
No
4
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)FootprintCapture Symbol
MPC8270CZUQLDA
(935319173557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)

Discontinued and Replacement Part Data

Part/12NCDiscontinuance Notice
MPC8270CZUQLDA
(935319173557)
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MPC8270CZUQLDA
(935319173557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC8270CZUQLDA
(935319173557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC8270

Introducing the next generation of PowerQUICC® II™ processors: the MPC8270, MPC8275 and MPC8280.

Utilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.

The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Our PowerQUICC II processors include a high-performance embedded 603e™ core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.

A range of performance and package options

Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.

The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.